Oxford Instruments
ngp80-rie
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Oxford NGP80 RIE is a plasma etch system located in room W1-062.[1]
What it is
General reference — not yet source-verifiedA reactive ion etch system is a dry etching tool used to remove material from a wafer with a plasma. Reactive ion etch tools are used when a process needs patterned transfer with directional control and chemistry matched to the film being etched. Reactive ion etch tools sit in the broader plasma processing class used in microfabrication and related thin film work.
How it works
The PlasmaPro NGP80 RIE is a reactive ion etching system from Oxford Instruments. The PlasmaPro NGP80 RIE was used with a CHF3/Ar plasma at a temperature of 20°C to etch silicon dioxide hard masks.[4]
Where it fits in the process flow
General reference — not yet source-verifiedReactive ion etch tools are commonly used after a masking layer has been defined by lithography and before later stripping, cleaning, deposition, or further pattern transfer steps. Reactive ion etching is part of pattern transfer in flows that build devices, interconnect features, microstructures, and test structures. Reactive ion etch steps are typically chosen when wet etching would not provide the needed profile control or material selectivity.
Applications
The PlasmaPro NGP80 RIE is used for reactive ion etching processes such as etching SiO2 hard masks with CHF3/Ar plasma. The PlasmaPro NGP80 RIE is used as part of a silicon nanostructure fabrication flow.[4]
What do the numbers mean?
Wafer handling1
Configuration & options7
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the ngp80-rie are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the ngp80-rie are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the ngp80-rie are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the ngp80-rie are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the ngp80-rie are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the ngp80-rie is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]confluence.nanofab.ualberta.ca — confluence.nanofab.ualberta.caconfluence.nanofab.ualberta.ca
- [2]confluence.nanofab.ualberta.ca — confluence.nanofab.ualberta.caconfluence.nanofab.ualberta.ca
- [3]waferpedia.com — waferpedia.comwaferpedia.com
- [4]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 16, 2026.
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