Oxford Instruments
Plasmalab 100 ICP 180 ICP-RIE
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Oxford Plasmalab 100 ICP 180 is an inductively coupled plasma reactive ion etch system. The Oxford Plasmalab 100 ICP 180 supports 2 inch wafers.[1]
What it is
How it works
General reference — not yet source-verifiedAn ICP-RIE system is a plasma etching tool that removes material from a wafer by combining chemically reactive species with ion-assisted surface bombardment. An ICP-RIE system uses an inductively coupled plasma source to generate a dense plasma while reactive ion etching conditions provide directional etching at the wafer surface. An ICP-RIE system is used when a process requires dry pattern transfer with stronger profile control than a purely isotropic plasma process.
Where it fits in the process flow
General reference — not yet source-verifiedA plasma etch system operates after a film has been deposited on a wafer and after a patterned masking layer has been formed. A plasma etch system transfers that pattern into the underlying layer by removing exposed material while protected areas remain in place. A plasma etch system is commonly followed by mask stripping, cleaning, inspection, or additional deposition and patterning steps.
Applications
General reference — not yet source-verifiedICP-RIE tools are used for pattern transfer in microfabrication workflows that need anisotropic dry etching. ICP-RIE tools are applied in semiconductor, microsystem, photonics, and related device fabrication where etched features must follow a lithographically defined mask. ICP-RIE tools are also used in process development and laboratory fabrication for etching films and substrate materials with plasma chemistries chosen for the target layer.
What do the numbers mean?
Wafer handling2
Configuration & options3
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What type of equipment is the Oxford Instruments Plasmalab 100 ICP 180 ICP-RIE?
The Oxford Instruments Plasmalab 100 ICP 180 ICP-RIE is an inductively coupled plasma reactive ion etch system.[1][2]
Not publicly documented
The following facts about the Plasmalab 100 ICP 180 ICP-RIE are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Plasmalab 100 ICP 180 ICP-RIE are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Plasmalab 100 ICP 180 ICP-RIE are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Plasmalab 100 ICP 180 ICP-RIE are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Plasmalab 100 ICP 180 ICP-RIE are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Plasmalab 100 ICP 180 ICP-RIE is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 16, 2026.
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