Oxford Instruments
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The Oxford Instruments Plasmalab ICP 380 is an inductively coupled plasma reactive ion etch system used for semiconductor etching.[1]
An ICP-RIE system combines a plasma source with reactive ion etching so that a gas mixture is ionized in a chamber and the resulting plasma is used to remove material from a target surface in a controlled way. The plasma source and wafer bias are used together to shape the etch direction and rate.
This class of tool is used in the etch module of a semiconductor process flow, after patterning has defined where material should be removed and before subsequent clean or deposition steps. It is used when anisotropic material removal is needed to transfer patterned features into a film or substrate.
ICP-RIE tools are used for dry etching of patterned semiconductor structures and for materials that require directional removal with good control of feature shape.
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It is used for inductively coupled plasma reactive ion etching.[1]
The following facts about the Plasmalab ICP 380 ICP-RIE are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the Plasmalab ICP 380 ICP-RIE are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Plasmalab ICP 380 ICP-RIE are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Plasmalab ICP 380 ICP-RIE are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Plasmalab ICP 380 ICP-RIE are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Plasmalab ICP 380 ICP-RIE are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
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Last updated Jul 29, 2026.