Plasma-Therm
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The Plasma-Therm SLR 770 RIE is a dual-chamber reactive ion etcher. The SLR 770 has a shuttle load lock and can process up to 8 inch wafers. The Plasma Therm SLR 770 dual chamber RIE has two chambers that support RIE or PE processing, with an adjustable top electrode gap, TMP turbo pumps, and eight gas lines with MFCs per chamber.[1][2]

A reactive ion etcher uses a low-pressure plasma to combine chemical reaction and ion-assisted bombardment at the wafer surface.
A load-lock chamber isolates the process chamber from ambient air during wafer transfer and supports faster wafer handling between pump-down cycles.
The Plasma-Therm SLR 770 RIE sits in the dry etch portion of the wafer flow, after pattern definition and before later device integration steps.
The Plasma-Therm SLR 770 RIE is used where patterned films or substrates require anisotropic material removal rather than wet chemical etching.
The Plasma-Therm SLR 770 RIE is used for reactive ion etching and plasma etching.[3][1]
Documented failure modes, common issues, and field considerations.
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The following facts about the SLR 770 RIE are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SLR 770 RIE are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the SLR 770 RIE are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the SLR 770 RIE are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the SLR 770 RIE is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the SLR 770 RIE are on record.
Answerable by: an OEM parts catalog or a service engineer
Last updated Oct 12, 2026.
The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.
Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.