PVA TePla

Plate 01PVATepla GIGABatch 360M O2 PLASMA power on DV
Plate 02穎強科技-PVA TePla 微波電漿清洗機 GIGAbatch 360 380P 介紹
Process applications and technology nodes documented for this tool.
Documented failure modes, common issues, and field considerations.
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
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The following facts about the GigaBatch are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the GigaBatch are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the GigaBatch are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the GigaBatch are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the GigaBatch is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the GigaBatch are on record.
Answerable by: an OEM parts catalog or a service engineer
Last updated Jul 29, 2026.
The PVA TePla 300 is a high-frequency plasma etch tool used for photoresist stripping, wafer surface cleaning, and hydrophilic surface enhancement.
The Tegal 1511e is a tri-electrode dual-frequency plasma etch system for processing three- to six-inch wafers.
General referenceLam Research 2300 is an etch system used for pattern transfer in semiconductor processing. It belongs to the class of plasma-based etch equipment used to remove selected material from a wafer according to a patterned mask.