PVA TePla
300
Wafer size
75 mm to 100 mm
Gas delivery
O2 (max. flow 500 ml/min)[1]
What is it?
What can it run?
Process applications and technology nodes documented for this tool.
- Photo Resist (PR) stripping
- Wafers surface cleaning before subsequent processes
- Enhancement of hydrophilic behavior of plastics surfaces
Why won't it start?
Documented failure modes, common issues, and field considerations.
- Materials that deteriorate easily upon exposure to oxygen, including Ag, Cu, Cr, and Fe, should not be processed in this machine.
What do the numbers mean?
Vacuum & pumping1
Wafer handling2
Gas & chemistry1
Configuration & options4
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the 300 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 300 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 300 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 300 are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the 300 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 300 are on record.
Answerable by: an OEM parts catalog or a service engineer
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]epfl.ch — epfl.chepfl.ch
- [2]Dry Etching — tudelft.nltudelft.nl
Last updated Jul 29, 2026.
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