Lam Research
2300
What it is
General reference — not yet source-verifiedEtch tools remove selected material from a wafer to transfer patterns and open features after lithography. This class of equipment is part of the middle of the wafer fabrication flow and is used to shape films on the substrate with controlled directional or selective material removal.
How it works
General reference — not yet source-verifiedAn etch system processes wafers in a chamber where gases or plasma chemistry react with exposed material. The tool is configured so process conditions can be tuned for the film type being removed, with separate chambers or process modules used for different etch and strip tasks.
Where it fits in the process flow
General reference — not yet source-verifiedEtch sits after lithography has defined a pattern in resist or another masking layer. It removes material from targeted regions of the wafer so the pattern becomes an actual structure in the underlying film or layer stack.
Applications
General reference — not yet source-verifiedEtch tools of this class are used across integrated-circuit manufacturing whenever a patterned film must be opened, thinned, or removed in a controlled way. They support process flows for both dielectric and conductor layers, as well as photoresist removal after pattern transfer.
What do the numbers mean?
Power & electrical1
- All Pumps, Generators & Other Subsystems Included[1]
Wafer handling1
Control & software1
- HDD & Software included[1]
Configuration & options4
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Lam 2300 Etch Chamber | — | 2023 | Described as an etch chamber with 8-inch and 12-inch wafer sizes, 3 chambers, and included subsystems/software. | Equipment inventory listing[1] |
| Lam 2300 | — | 2019 | Listed as 12-inch equipment with KIYO EXP MRT. | Equipment inventory listing[2] |
| Lam 2300, 12" KIYO EXP MRT | — | 2019–2019 | Described as a 12-inch unit with KIYO EXP MRT. | Equipment inventory listing[2] |
| Lam 2300, 12" | — | 2016–2016 | Described as a 12-inch unit. | Equipment inventory listing[3] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- ConfigurationAll Pumps, Generators & Other Subsystems Included[1]
Where are the manuals?
Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.
- ADP-ADS Series 2 Dry Pump User Manual - mu_adp2-lm-p-h_05_gb_release07-08.pdfManualumd.edu
- wet_etch_121500.pdfDocumentumd.edu
- ADP-ADS Series 2 Dry Pump User Manual - mu_adp2-lm-p-h_05_gb_release07-08.pdfManualumd.edu
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What does an etch system do in semiconductor manufacturing?General reference — not yet source-verified
It removes selected material from a wafer so that the pattern created by lithography is transferred into the film or substrate.
Is this class of tool used before or after lithography?General reference — not yet source-verified
It is used after lithography has defined the mask pattern and before later process steps add or connect additional structures.
What kind of material removal does this class perform?General reference — not yet source-verified
It performs controlled, selective removal from exposed regions while leaving masked regions largely protected.
Why is process control important in an etch tool?General reference — not yet source-verified
Process control determines how uniformly and selectively material is removed, which affects feature shape, pattern fidelity, and layer integrity.
What kinds of structures are made with etch equipment?General reference — not yet source-verified
It is used to define circuit features, open contact areas, and shape layers used in integrated circuits and related microfabricated devices.
Not publicly documented
The following facts about the 2300 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2300 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 2300 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2300 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 2300 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 2300 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]inventory listing
- [3]Equipment inventory listing
- [4]ADP-ADS Series 2 Dry Pump User Manual - mu_adp2-lm-p-h_05_gb_release07-08.pdf — nanocenter.umd.edunanocenter.umd.edu
- [5]Prestis™ - Lam Research — lamresearch.com (May 19, 2026)web.archive.org
Last updated Jul 30, 2026.
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