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SCREEN

SS 80 BW AR Wafer

Wet Processing / CleanSCREEN SS 80 family
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The SCREEN SS 80 BW AR Wafer is a wafer scrubber. The SCREEN SS 80 BW AR Wafer is for eight-inch wafers. The SCREEN SS 80 BW AR Wafer is configured with two reverser functions, three backside stations, and three frontside soft spray and scrub stations.[1][2]

SS 80 BW AR Wafer — Inventory photo
Fig. 01SS 80 BW AR WaferInventory photo[1]

What it is

The SCREEN SS 80 BW AR Wafer is a wafer scrubber for eight-inch wafers. The machine belongs to wet processing and clean equipment used to remove surface contamination from wafers during semiconductor manufacturing.[1][2]

How it works

The SS 80 BW AR Wafer is configured with two reverser functions, three backside stations, and three frontside soft spray and scrub stations.[1][2]

Where it fits in the process flow

General reference — not yet source-verified

The SCREEN SS 80 BW AR Wafer fits in the wet cleaning portion of semiconductor wafer processing. The machine is used before subsequent process steps that benefit from a cleaner wafer surface, such as downstream deposition, lithography, or inspection operations.

Applications

The SS 80 BW AR Wafer is configured for frontside and backside cleaning operations. The machine uses CO2 sparged DIW and multiple flow controllers, which support wet-cleaning process control.[1][2]

What do the numbers mean?

Wafer handling4

Chuck Type/ Material
Stainless Steel / Teflon, Nylon[1]
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Robot Type
DNS[1]
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Type
Wafer scrubber[2]
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Wafer size
8 inch[1]
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Gas & chemistry2

MFC
5 Horiba SEC 4600[1]
Accurate?
Chemistry
CO2 Sparged DIW[1]
Accurate?

Control & software1

Software
SYS Ver 394 F[1]
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Configuration & options5

2 Reverser[1]
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3 Backside[1]
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3 Frontside Soft Spray & Scrub[1]
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CO2 Sparged DIW[1]
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Category
Wet Processing / Clean[2]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • MFC5 Horiba SEC 4600[1]
  • ChemistryCO2 Sparged DIW[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What types of chemical processes can this class of machine perform?General reference — not yet source-verified

Machines of this class can perform cleaning, rinsing, wet etching, and surface preparation using standard semiconductor-grade chemistries such as acids, solvents, and deionized water. The exact process capability depends on the installed hardware and recipe configuration.

What kind of automation is typically included?General reference — not yet source-verified

Such systems usually include a wafer handling robot, load ports or cassette stations, process chambers, chemical delivery systems, and a control interface for recipe management and data logging. The equipment is designed to operate with minimal manual intervention.

What routine maintenance is required?General reference — not yet source-verified

Routine maintenance includes cleaning process nozzles and chambers, calibrating liquid flow controllers, replacing filters, verifying sensor readings, and checking exhaust and drain systems. Scheduled maintenance helps maintain process consistency and prolong equipment life.

Can the system be adapted for different wafer sizes?General reference — not yet source-verified

Some machines of this class can be configured with different chuck and handling hardware for various substrate sizes, while others are fixed for a specific size. Adaptation requires proper tooling changeover and recipe validation.

Not publicly documented

The following facts about the SS 80 BW AR Wafer are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SS 80 BW AR Wafer are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the SS 80 BW AR Wafer are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the SS 80 BW AR Wafer are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the SS 80 BW AR Wafer are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the SS 80 BW AR Wafer is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]waferpedia.com — waferpedia.comwaferpedia.com
  3. [3]Inventory photo
  4. [4]Inventory photo
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Last updated Oct 13, 2026.

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