SPTS
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Plate 01Joe "Masher" Miller - The Rise of a Champion | Boxing Promo | C2L Promotions
Plate 02Curl dos à la poulie
Plate 03flexion Psoas à la poulie
Plate 04Rear delt unilatéral à la poulie
Plate 05Élévations frontales avec élastique
Plate 06Cable chest press sur banc incliné
Deep reactive ion etchers are plasma process tools used to anisotropically remove silicon in patterned areas. Deep reactive ion etchers are used after lithographic patterning to transfer mask-defined features into the wafer.
The NIST process flow used the SPTS Omega c2L Rapier for the DRIE step after photolithography on a silicon wafer. The patterned chips were then bonded to a blank chip after the wafer was diced.[2]
In the NIST manufacturing sequence, lithography was implemented on a silicon wafer and followed by a DRIE process on the SPTS Omega c2L Rapier. In the same sequence, the wafer was diced to smaller chips and the patterned chips were bonded to a blank chip after etching.[2]
The NIST study used the SPTS Omega c2L Rapier to generate controlled flaws by deep reactive ion etching after stepper lithography. The study produced holes with various shapes and distribution patterns and used a chip bonding method to convert manufactured holes into internal pores.[2]
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Omega c2L Rapier | — | — | — | doi.org[2] |
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SPTS offered Operation and Maintenance training for the 200mm c2L Monarch and also offered a c2L Set-up & Repair course.[1]
The NIST fabrication flow used an SPTS Omega c2L Rapier deep silicon etcher for the DRIE process.[2]
The following facts about the c2L are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the c2L are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the c2L are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the c2L are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the c2L is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the c2L are on record.
Answerable by: an OEM parts catalog or a service engineer
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Last updated Oct 17, 2026.