SPTS

The SPTS CET25 is a 25-wafer batch process module for HF vapor release etch for MEMS.

The SPTS MVD100E is a Molecular Vapor Deposition system designated for R&D or pilot manufacturing.

The SPTS / STS Multiplex ICP is a dry etcher manufactured by SPTS / STS.

The SPTS XeF2 is a highly selective isotropic etching system for Si, Mo, Ge, and W, with room-temperature operation and no plasma.

The SPTS / STS Sigma FxP is a PVD system with 6-inch wafer size and 8-inch compatibility.

SPTS lists the c2L as a 200mm tool in its Equipment Training course offerings.

The SPTS / STS CPX Pegasus is an etcher with 8-inch wafer support and a two-chamber configuration.

SPTS uEtch is a vapor-phase selective isotropic etch system for sacrificial oxide release etching.

The SPTS MVD4500 is a molecular vapor deposition system for panel and large substrate processing.

The SPTS MVD300 is a Molecular Vapor Deposition system designed for high-performance, flexible, reliable high-volume manufacturing applications.

The SPTS RIE-10 is a state-of-the-art deep silicon etching system with dual plasma sources, dual gas inlets, and specified performance for high-aspect-ratio silicon etching.

The SPTS Rapier is an optimized deep reactive ion etching (DRIE) system for silicon and silicon-on-insulator wafers.

The SPTS / STS Sigma is a PVD system configured for 6-inch wafers and includes multiple process stations, including pre-heat, aluminum deposition, titanium/titanium nitride deposition, and soft sputter etch.

SPTS APS is an ICP-based high-density plasma etching system optimized for dielectric etching and single-wafer processing.

The SPTS / STS CPX Pegasus Polysilicon is an etch tool stated to handle 8-inch wafers.

The SPTS Synapse is an ICP-based high-density plasma etcher dedicated to etching SiO2 and SixNy layers.

The SPTS / STS MACS ICP is an 8-inch etcher with an HR chamber and cassette-to-cassette MACS loader.