SPTS

uEtch

Etch SPTS uEtch family

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uEtch — epfl.ch — Fig. 01uEtchepfl.ch^[1]

Vacuum

125 Torr fixed for the standard processes^[1]

Optics

12 nm/min^[1]

What is it?

The SPTS uEtch performs vapor-phase, selective, isotropic etching on sacrificial oxide to release devices. The source describes a vacuum-based, gas-phase process using anhydrous HF and ethanol, with five standard recipes operating at 125 Torr and minimum etch rates listed for thermal oxide.

What can it run?

Process applications and technology nodes documented for this tool.

Sacrificial SiO2 etching for MEMS release

Why won't it start?

Documented failure modes, common issues, and field considerations.

Some materials are not compatible with the tool, including polymers (PR, Quickstick, Tape), soda-lime (float glass), Borofloat, Ge, Ti, TiN, Ta, TaN, TaOxide, and silicon nitride (subject to exceptions).

What do the numbers mean?

Vacuum & pumping1

Operating pressure: 125 Torr fixed for the standard processes^[1]

Gas & chemistry1

Process chemistry: Anhydrous HF and ethanol (C2H5OH) with nitrogen (N2) gas mixture^[1]

Optics & imaging5

Minimum etch rate - Recipe1: 12 nm/min^[1]
Minimum etch rate - Recipe2: 38 nm/min^[1]
Minimum etch rate - Recipe3: 125 nm/min^[1]
Minimum etch rate - Recipe4: 153 nm/min^[1]
Minimum etch rate - Recipe5: 175 nm/min^[1]

Control & software1

Standard recipes: Recipe1, Recipe2, Recipe3, Recipe4, Recipe5^[1]

Configuration & options1

Process type: Vapor-phase, selective, isotropic etch on sacrificial oxide^[1]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Process chemistryAnhydrous HF and ethanol (C2H5OH) with nitrogen (N2) gas mixture^[1]
Operating pressure125 Torr fixed for the standard processes^[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Not publicly documented

The following facts about the uEtch are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the uEtch are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the uEtch are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the uEtch are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the uEtch is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the uEtch are on record.
Answerable by: an OEM parts catalog or a service engineer

Sources & citations

Sources (3)Every fact above is drawn from these public sources

[1]epfl.ch — epfl.chepfl.ch
[2]Vapor Etching | Stanford Nanofabrication Facility — snfguide.stanford.edusnfguide.stanford.edu
[3]SPTS Primaxx uEtch for HF vapor release etch for MEMS — spts.com (May 5, 2018)web.archive.org