Waferpedia

STS

AOE Pro ICP

Etch
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Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

STSAOE Pro ICP
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What it is

The STS AOE Pro is an inductively coupled plasma (ICP) etcher manufactured by STS (Surface Technology Systems).[1]

How it works

General reference — not yet source-verified

An ICP etcher generates a high-density plasma by applying radio-frequency power to a coil or antenna around the process chamber, creating a strong electromagnetic field that ionizes the process gas.

A separate RF bias applied to the wafer chuck accelerates ions toward the wafer surface, enabling directional etching with controlled ion energy and minimal sidewall damage.

Where it fits in the process flow

General reference — not yet source-verified

ICP etchers are typically used in the front-end-of-line and back-end-of-line process flows after photolithography to define patterns in the underlying substrate or thin films.

Downstream processes include resist stripping and wet cleaning, while upstream steps involve mask deposition and patterning.

Applications

General reference — not yet source-verified

ICP etching is applied to a wide range of materials including silicon, silicon dioxide, silicon nitride, and various metals for applications such as trench isolation, gate etching, and contact hole formation.

What do the numbers mean?

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Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What type of etching technology does the STS AOE Pro use?

The STS AOE Pro uses inductively coupled plasma (ICP) etching.[1]

What is the full model name of this ICP etcher?

The full model name is the STS AOE Pro ICP Etcher.[1]

Not publicly documented

The following facts about the AOE Pro ICP are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No specifications for the AOE Pro ICP are on record.

    Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the AOE Pro ICP are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the AOE Pro ICP are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the AOE Pro ICP are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the AOE Pro ICP are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

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Sources & citations

Sources (1)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
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Last updated Aug 20, 2026.

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