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SUSS MicroTec

MA 200

LithographySUSS MicroTec MA 200 family
Research Quality: 70% complete
MA 200 — Inventory photo
Fig. 01MA 200Inventory photo[1]

Power

230 V[1]

Optics

Lens[1]

What it is

The SUSS MicroTec MA 200 is a lithography mask aligner used in semiconductor manufacturing. The model appears in configurations for 6-inch and 8-inch wafer sizes.[1][3][4][5]

How it works

For the MA 200, the listed equipment configurations include optical and control components such as lenses, mirrors, a lamp, a monitor, a display, a focus controller, a fixed blanket, a cover, a cable duct, and a video control unit.[1]

Applications

General reference — not yet source-verified

This class of tool is used for photolithographic patterning in semiconductor and microfabrication work, including device fabrication, process development, and small-volume production where precise mask-to-wafer alignment is needed.

What do the numbers mean?

Power & electrical2

Voltage
230 V[1]
Accurate?
Frequency
50 Hz[1]
Accurate?

Optics & imaging1

Lens[1]
Accurate?

Control & software2

Focus Controller[1]
Accurate?
Video Control Unit[1]
Accurate?

Configuration & options8

3200 VA[1]
Accurate?
Mirror 1, Mirror 2, Mirror 3[1]
Accurate?
Lamp[1]
Accurate?
Monitor[1]
Accurate?
Display[1]
Accurate?
Fixed Blaket[1]
Accurate?
Cover[1]
Accurate?
Cable Duct[1]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Voltage230 V[1]
  • Frequency50 Hz[1]

Where are the manuals?

Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Frequently asked questions

What does a lithography system do?General reference — not yet source-verified

It transfers a pattern from a mask into a photosensitive layer on a substrate so that the pattern can be developed and used in later fabrication steps.

Where is this class used in process flow?General reference — not yet source-verified

It is used early in the fabrication sequence, after surface preparation and resist coating and before pattern transfer or material removal steps.

What kinds of processes use this class of machine?General reference — not yet source-verified

It is used in microfabrication processes that require precise feature definition, including electronic, photonic, and microstructured device manufacturing.

Why is alignment important in this class of equipment?General reference — not yet source-verified

Alignment ensures that the exposed pattern is registered correctly to existing features or to the substrate layout, which is essential for device accuracy and layer-to-layer overlay.

What is the main output of the lithography step?General reference — not yet source-verified

The output is a patterned resist image that serves as the template for the next manufacturing operation.

Not publicly documented

The following facts about the MA 200 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MA 200 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the MA 200 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the MA 200 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the MA 200 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the MA 200 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (8)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]Inventory photo
  3. [3]Equipment inventory listing
  4. [4]Equipment inventory listing
  5. [5]Equipment inventory listing
  6. [6]AZ 4330 full data sheetcores.research.asu.educores.research.asu.edu
  7. [7]AZ P4620 Positive Photoresistece.utoronto.caece.utoronto.ca
  8. [8]3D Lithography: SUSS MicroTecsuss.com (Jan 21, 2012)web.archive.org
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Last updated Jul 29, 2026.

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