SUSS MicroTec

The SUSS MicroTec MA 8 Gen 3 Mask Aligner is a mask aligner for semiconductor lithography. It is configured for 8-inch wafers and uses TSA alignment, with a slide-in pneumatic locking SQR 9 mask holder and no backside alignment.[2]
In mask-aligner lithography, the wafer is placed in the exposure position, the mask is brought into alignment with the wafer, and the pattern is exposed through the mask onto a photoresist-coated surface. Alignment accuracy depends on the tool's mechanical positioning and optical alignment method.
Mask alignment and exposure occur after wafer preparation and photoresist coating, and before resist development and subsequent etch, deposition, or lift-off steps that transfer the pattern into the underlying material.
Mask aligners are used for photolithographic patterning in semiconductor and microfabrication work, especially where direct alignment of a mask to a wafer is required.
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The following facts about the MA 8 Gen 3 Mask are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MA 8 Gen 3 Mask are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the MA 8 Gen 3 Mask are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the MA 8 Gen 3 Mask are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the MA 8 Gen 3 Mask are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the MA 8 Gen 3 Mask is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Jul 29, 2026.
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