SUSS MicroTec
XBC300 Gen2 D2W
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
General reference — not yet source-verifiedPermanent bonding systems join wafers or dies to substrate carriers using processes such as thermocompression, eutectic, or adhesive bonding. The die-to-wafer configuration mounts individual dies onto a target wafer, enabling heterogeneous integration.
How it works
The XBC300 Gen2 D2W is built on a scalable, modular platform that adapts to customer needs to ensure device quality and yield. The XBC300 Gen2 D2W is a high-precision bonding solution.[1]
Applications
General reference — not yet source-verifiedThe XBC300 Gen2 D2W is used for permanent bonding processes in semiconductor packaging. The system supports applications requiring the integration of multiple device types, such as memory-on-logic or sensor-on-CMOS stacks.
What do the numbers mean?
Wafer handling1
Configuration & options2
Vintage & configurations
Documented models & variants
What replaced it?
Related models
- siblingSUSS MicroTec XBC300 Gen2 D2W/W2W— The XBC300 Gen2 D2W is a variant of the XBC300 Gen2 platform for die-to-wafer bonding.source[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the XBC300 Gen2 D2W are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the XBC300 Gen2 D2W are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the XBC300 Gen2 D2W are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the XBC300 Gen2 D2W are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the XBC300 Gen2 D2W is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the XBC300 Gen2 D2W are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]suss.com — suss.comsuss.com
Last updated Sep 21, 2026.
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