Tokyo Electron

Plate 01Replacement LCD Screens for TEL Mark 8, Mark 7, Mark Vz & ACT 8 Systems
Wafer size
Parallel wafer flow processing software option (simultaneous coat & develop)
Gas delivery
2 coater / 2 developer[1]
Tokyo Electron Mark 8 is a lithography system. Machines of this class expose a photosensitive layer with an optical pattern so that selected areas can be retained or removed after development.
Such systems are central pattern-definition tools in semiconductor manufacturing and related precision patterning work. They are used wherever a controlled image must be transferred onto a substrate before etching, deposition, or other downstream processing.
A lithography system presents a pattern to the coated substrate through an optical path or equivalent projection arrangement. The exposed resist responds to the projected image, creating a latent pattern that can be made visible and used as a processing mask.
In general, the machine aligns the substrate to previously formed features, controls exposure across the target area, and repeats the imaging sequence as needed across the workpiece. The result is a patterned resist template that reflects the intended circuit geometry or other fine structures.
This class of machine sits early in the pattern-transfer portion of the process flow, after surface preparation and resist coating and before development, etching, implantation, or lift-off steps. It is one of the main points at which design information becomes a physical pattern on the wafer.
Machines of this class are used for semiconductor device fabrication and other microfabrication tasks that require precise repeated pattern placement. They support the creation of transistors, interconnect structures, alignment marks, and other fine features on processed substrates.
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Tel Mark 8 Developer | — | 1993 | Developer configuration for 6-inch wafers. | Equipment inventory listing[7] |
| Tel Mark 8 Coater | — | 1992 | Coater configuration for 6-inch wafers. | Equipment inventory listing[8] |
| Tel MARK 8 | — | 1998 | 8-inch SOGT configuration. | Equipment inventory listing[6] |
| Mark 8 Developer | — | 1993 | — | Equipment inventory listing[7] |
| Mark 8 Coater | — | 1992 | — | Equipment inventory listing[8] |
| Mark 8 | — | 1998 | Listed as a coater/developer with parallel wafer flow processing software option (simultaneous coat & develop). | Equipment inventory listing[1] |
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
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It transfers a desired pattern onto a photoresist-coated substrate so that the pattern can guide later fabrication steps.
It defines where material will be removed, added, or modified in later steps, so it sets the shape and placement of many device features.
The exposed resist is developed and then used as a mask for downstream operations such as etching, implantation, or deposition-related pattern transfer.
Such systems are generally used on semiconductor wafers and other precision substrates that require fine patterned structures.
The following facts about the Mark 8 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Mark 8 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the Mark 8 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Mark 8 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Mark 8 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly hosted manuals, SOPs, or datasheets for the Mark 8 are on record.
Answerable by: university cleanroom staff or an OEM application specialist
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Last updated Jul 30, 2026.
The CEE 100 is a lithography spin coater/developer tool that accepts up to 6-inch wafers and supports programmable multi-step processing.
The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.