P 12 XLm

Wafer probers are semiconductor test handling systems that bring individual dies or test structures on a wafer into electrical contact with a probe card. Wafer probers are generally used before singulation so that devices can be screened, characterized, or monitored while still on the wafer. Wafer probers commonly operate alongside parametric test equipment, reliability test setups, or automated test equipment in wafer sort and engineering test flows.

Wafer probers move a wafer into a measurement position and align wafer features to a probe interface so electrical measurements can be made on selected sites. Wafer probers generally use controlled wafer positioning, chuck handling, and repeated stepping across the wafer to present die after die to the test hardware. Wafer probers are designed to support repeatable contact between the wafer and probing hardware during electrical test routines.

Wafer probing sits after front end and back end wafer fabrication steps have created the structures to be measured and before dicing and package level final test. Wafer probers are used in engineering and production test flows to verify device behavior, collect wafer level data, and separate passing from failing die before assembly. Wafer probing can also support inline monitoring of process health through test structures placed on product wafers or monitor wafers.

Wafer probers are used for wafer sort, parametric measurements, device characterization, reliability studies, and process control measurements. Wafer probers can be applied to integrated circuits, discrete semiconductor devices, and dedicated test structures formed on semiconductor wafers. Wafer probing is also used when engineers need electrical data from devices before singulation and packaging.