Tokyo Electron
P 8 XL II
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedA wafer prober positions a wafer with controlled motion and aligns probe needles or probe tips to contact device pads on the wafer surface.
The prober supports electrical test access at wafer level so that devices can be measured before the wafer moves to later process steps.
Where it fits in the process flow
General reference — not yet source-verifiedThe P 8 XL II fits into wafer-level test flow after fabrication steps that leave accessible pads or structures for probing.
The prober sits before die separation and package-level test when electrical characterization at the wafer stage is required.
Applications
The P 8 XL II is used for wafer probing in semiconductor test and probe operations.[1]
What do the numbers mean?
Wafer handling1
Configuration & options3
- Compact[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is it used for?
It is used for test and probe work.[1]
Not publicly documented
The following facts about the P 8 XL II are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the P 8 XL II are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the P 8 XL II are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the P 8 XL II are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the P 8 XL II are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the P 8 XL II is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]inventory listing
Last updated Oct 13, 2026.
Compare with similar tools
View all →The Tenney TPS JR-A-F4T is a junior compact temperature test chamber with a 1.2 cubic foot chamber size and a temperature range of -68°C to +180°C.
The Rorze 03 RR 8120-001-001 is a wafer exchanger for 8-inch wafers.
The KLA 1007 is a wafer prober manufactured by KLA.