Tokyo Electron
TE 8500
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Tokyo Electron TE 8500 is an etch system from Tokyo Electron. The TE 8500 P Dry is a dry etching system for 6-inch wafers. The TE 8500 PESC Dry is a dry etcher with one chamber for oxide etch with endpoint capability.[1][2]
What it is
General reference — not yet source-verifiedEtch systems remove selected material from a wafer surface after a patterned masking layer has defined where removal should occur. Dry etch tools use reactive gases and plasma-assisted surface reactions to transfer patterns into films with controlled directionality and selectivity. Etch equipment is a core pattern-transfer class used during semiconductor fabrication after films have been deposited and patterned.
How it works
The TE 8500 family includes dry-etch variants. The TE 8500 P is a dry etching system for 6-inch wafers. The TE 8500 PESC Dry is a dry etcher with one chamber for oxide etch with endpoint capability.[1]
Where it fits in the process flow
General reference — not yet source-verifiedEtch tools sit after film formation and lithographic patterning in the semiconductor process flow. Etch tools transfer the resist-defined pattern into underlying dielectric, conductive, or semiconducting layers. Etch tools are followed by resist stripping, cleaning, inspection, and later module steps that build the next patterned level.
Applications
The TE 8500 family includes an oxide-etch variant with endpoint capability. The TE 8500 family also includes a dry etching system for 6-inch wafers.[1]
What do the numbers mean?
Wafer handling3
Configuration & options10
Vintage & configurations
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wafer sizes does the TE 8500 family support?
The TE 8500 P Dry supports 6-inch wafers, while other TE 8500 models support 8-inch wafers.[1][4][3][2]
What are the key features of the TE 8500 PESC Dry?
The TE 8500 PESC Dry is a single-chamber dry etcher for oxide etching with endpoint detection capability.[1]
Not publicly documented
The following facts about the TE 8500 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the TE 8500 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the TE 8500 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the TE 8500 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the TE 8500 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the TE 8500 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]waferpedia.com — waferpedia.comwaferpedia.com
- [2]layla-ec.com — layla-ec.comlayla-ec.com
- [3]Equipment inventory listing
- [4]Equipment inventory listing
Last updated Oct 17, 2026.
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