YES

310TA

Thermal / Diffusion up to 6-inch wafers YES 310TA family

Research Quality: 50% complete

LinkedIn X Email

310TA — colorado.edu — Fig. 01310TAcolorado.edu^[1]

Wafer size

up to 6-inch wafers

Vacuum

Vacuum cure & HMDS vapor prime oven^[2]

Optics

300 s^[2]

What is it?

The sources describe the YES 310TA as a vacuum cure and HMDS vapor prime oven. It is listed as an HMDS prime oven, and one source states it batches primes Si, native or film SiO2, and Si3N4 with silane molecules to enhance adhesion of polymers such as photoresists. The equipment is described as using HMDS in vapor phase, with a 150 °C process temperature and 300 s exposure time, and it accepts 4-inch or 6-inch wafers in 25-slot metal carriers.

What can it run?

Process applications and technology nodes documented for this tool.

Batch priming of Si, native or film SiO2, and Si3N4
Enhancing adhesion of polymers such as photoresists
HMDS treatment before spin coating

What do the numbers mean?

Vacuum & pumping1

Description: Vacuum cure & HMDS vapor prime oven^[2]

Wafer handling2

Carrier capacity: 25 slots for 4-inch or 6-inch wafers per cassette^[2]
Wafer compatibility: up to 6-inch wafers^[2]

Optics & imaging1

Exposure time: 300 s^[2]

Configuration & options5

Model: 310TA^[1]
Equipment type: HMDS Vapor Prime Oven^[1]2 sources
Priming agent: HMDS in vapor phase^[2]
Process temperature: 150 °C^[2]
Total process time including purges: ~15 min^[2]

Vintage & configurations

Documented models & variants

Designation	Generation	Vintage	Changes	Source
YES-310TA	—	—	—	web.archive.org^[3]

Interested in this tool?

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

DescriptionVacuum cure & HMDS vapor prime oven^[2]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the 310TA are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 310TA are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 310TA are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 310TA are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 310TA is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 310TA are on record.
Answerable by: an OEM parts catalog or a service engineer