PB6-2P-CP

The YES PB6-2P-CP is a manual batch and automated polyimide, BCB, and copper anneal vacuum oven in the YES product line. The YES PB6-2P-CP appears within the YES 450PB Bake Ovens family of high temperature vacuum bake and cure ovens for BCB and polyimide. The YES PB6-2P-CP accommodates 2 cassettes of 5 inch or 6 inch wafers, or 3 cassettes of 4 inch wafers. The YES PB6-2P-CP has a 316L stainless steel chamber with dimensions of 10.75 inches inside diameter by 22.2 inches deep by 7.5 inches high. The YES PB6-2P-CP is specified for uniformity at dwell of +1 to -3.5 degrees Celsius.^[4][2]

The YES 450PB Bake Ovens operate at temperatures up to 450 degrees Celsius. During operation, nitrogen is preheated to the selected operating temperature and passes in laminar flow from the roof of each individual chamber down over the cassettes of wafers and out through each chamber base. Substrates in the preheated gas flow are washed clean of particles as the cycle proceeds. Particles are removed by exhaust during each evacuation cycle. The YES PB6-2P-CP uses a CTC controller with a front panel color touchscreen and multiple PIDs. The system provides 8 separate recipes with up to 16 ramps and dwells in each recipe.^[2]

Thermal vacuum ovens are typically placed after coating, deposition, plating, or assembly steps that leave films, adhesives, or bonded interfaces requiring cure or anneal. Thermal vacuum ovens are typically used before subsequent lithography, etch, metallization, dicing, or package assembly steps that depend on stabilized film properties and reduced residual volatiles.

Vacuum cure ovens are commonly used where polymer films, dielectric coatings, bonding layers, or assembled substrates need controlled heating with reduced oxidation and contamination exposure. Vacuum cure ovens are also used for process integration work in microfabrication and packaging where repeatable thermal treatment affects adhesion, stress, outgassing, and final material properties.