ASM

AD 838

Research Quality: 50% complete

The ASM AD 838 is a die bonder. The ASM AD 838 includes an 8-inch wafer table and epoxy dispensing capability. The ASM AD 838 operates on single-phase 220 Vac at 50/60 Hz.^[1]

AD 838 — Inventory photo — Fig. 01AD 838Inventory photo^[1]

Wafer size

Power

220 Vac^[2]

What it is

The ASM AD 838 is a die bonder. The AD 838 includes an 8-inch wafer table and epoxy dispensing. The AD 838 configuration does not include a stack input.^[2]^[1]

Where it fits in the process flow

General reference — not yet source-verified

Die bonding is part of the semiconductor back-end packaging process. A die bonder operates after wafer dicing and before wire bonding and encapsulation. The bonder places die onto lead frames, substrates, or other carriers that become finished packages. Downstream steps include adhesive cure, wire bonding, and molding or encapsulation.

Applications

General reference — not yet source-verified

Die bonders of this class are used to assemble integrated circuits, discrete semiconductors, power devices, and other packaged microelectronic components. Epoxy die attach is used where the adhesive bond line provides electrical isolation and mechanical support between the die and the carrier. A die bonder can handle die from wafers into a range of package carriers for wire-bonded and some leadless package formats.

What do the numbers mean?

Power & electrical5

Voltage: 220 Vac^[2]; 50/60 Hz^[2]
Electrical supply phases: 1 phase^[2]
Supply voltage: 220 Vac^[2]
Supply frequency: 50/60 Hz^[2]

Wafer handling2

Wafer size: 8" wafer table^[1]
Wafer table size: 8 inches^[1]

Configuration & options6

Epoxy dispensing^[1]; No Stack input^[1]
Phase: 1 Phase^[2]
Tool function: Die bonder^[2]
Epoxy dispensing: Yes^[1]
Stack input: No^[1]

Interested in this tool?

Embed spec card

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Voltage220 Vac^[2]
Configuration50/60 Hz^[2]
Electrical supply phases1 phase^[2]
Supply voltage220 Vac^[2]
Supply frequency50/60 Hz^[2]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What type of equipment is the ASM AD 838?

The ASM AD 838 is a die bonder.^[2]

What wafer table size is specified for the AD 838?

The AD 838 has an 8-inch wafer table.^[1]

Does the AD 838 provide epoxy dispensing?

The AD 838 includes epoxy dispensing.^[1]

What electrical supply is specified for the AD 838?

The AD 838 is specified for single-phase 220 V AC at 50/60 Hz.^[2]

Not publicly documented

The following facts about the AD 838 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the AD 838 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the AD 838 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the AD 838 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the AD 838 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the AD 838 is not on record.
Answerable by: an OEM datasheet or a fab qualification report