Tool family
Cited variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| NSX 105 | — | 2003–2007 | Source records describe configurations including 1 chamber / 2LP, load ports for 6" and 8", Brooks robot and aligner, 12" wafer stage, and CCD 3D camera options, with vintages stated as 2003, 2004, and 2007. | Equipment inventory listing[1] |
The NSX 105 is an automated wafer, die, and bump inspection system.
The ONTO / Rudolph / August NSX 105 D is an automated wafer, die, and bump inspection system.
The NSX 105 is an automated wafer, die, and bump inspection system.
The ONTO / Rudolph / August NSX 105 D is an automated wafer, die, and bump inspection system.