Onto Innovation
NSX 105 Automated Wafer, Die & Bump
The Onto Innovation NSX 105 is an automated inspection system for wafers, dies, and bumps. The NSX 105 supports wafer sizes from 4 to 8 inches and is configured as an automatic defect inspection system.[1][2]
What is it?
Applications
What do the numbers mean?
Power & electrical13
Wafer handling9
- No robot[4]
Optics & imaging11
Control & software12
Configuration & options34
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- KLA ILM 2139 Patterned Wafer— Same function class: Metrology & Inspection, nullCompare in depthsource[6]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- ConfigurationSingle phase + GND[4]
- Configuration200-240 vac, 50/60 Hz[4]
- Full load6 amps[4]
- Largest load1.5 amps[4]
- Main Breaker20 Amps/10,000 AIC[2]
- Power Supply200-240 VAC, 50/60 Hz[2]
- Full Load Current6 Amps[2]
- Main Breaker Rating20 Amps/10,000 AIC[2]
- Power Supply200-240 VAC, 50/60 Hz, Single phase + GND[4]
- Power200-240 VAC, 50/60 Hz, single phase, full load 6 A, largest load 1.5 A[4]
- Power200-240 VAC, 50/60 Hz, 1 Phase + GND[4]
- Power200-240 VAC, 50/60 Hz[2]
- Frequency50/60 Hz[2]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the NSX 105 Automated Wafer, Die & Bump are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the NSX 105 Automated Wafer, Die & Bump are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the NSX 105 Automated Wafer, Die & Bump are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the NSX 105 Automated Wafer, Die & Bump are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the NSX 105 Automated Wafer, Die & Bump are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the NSX 105 Automated Wafer, Die & Bump is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (6)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]inventory listing
- [3]Inventory photo
- [4]Inventory photo
- [5]Inventory photo
- [6]waferpedia.comwaferpedia.com
Last updated Oct 19, 2026.
Compare with similar tools
View all →
The KLA ILM 2139 is a patterned wafer inspection system.
The KLA .204 PSL Wafer is an 8-inch NIST-traceable reference wafer compatible with Surfscan 6xy0 and Sp1 particle counters.
KLA .496 PSL Wafer is an 8-inch NIST traceable wafer stated to be capable on Surfscan 6xy0 and SP1.
The KLA .498 PSL Wafer is a NIST traceable reference wafer.
