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NSX 105 Automated Wafer, Die & Bump

NSX 105 Automated Wafer, Die & Bump — Inventory photo
Fig. 01NSX 105 Automated Wafer, Die & BumpInventory photo[1]

Power

Single phase + GND[2]

Optics

1, 2, 5, 20x[5]

What is it?

The NSX 105 is an automated wafer, die, and bump inspection system.

What do the numbers mean?

Power & electrical5

Single phase + GND[2]
Accurate?
200-240 vac, 50/60 Hz[2]
Accurate?
Full load
6 amps[2]
Accurate?
Largest load
1.5 amps[2]
Accurate?
Main Breaker
20 Amps/10,000 AIC[4]
Accurate?

Wafer handling1

No robot[2]
Accurate?

Optics & imaging3

Objectives
1, 2, 5, 20x[5]
Accurate?
Laser focus sensor[5]
Accurate?
Adimec inspection camera[5]
Accurate?

Control & software2

PC[5]
Accurate?
NSK controller for theta[5]
Accurate?

Configuration & options12

Parts machine[2]
Accurate?
Automatic Defect Inspection System[4]
Accurate?
Power
200-240 VAC[4]
Accurate?
50/60Hz[4]
Accurate?
Largest Load
1.5Amps[4]
Accurate?
1 Phase + GND[4]
Accurate?
Ultraport top plate[5]
Accurate?
Worm screw for Y[5]
Accurate?
Linear for X[5]
Accurate?
Toshiba for color review[5]
Accurate?
1 genesis main board[5]
Accurate?
3 Genesis Node board[5]
Accurate?
Interested in this tool?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • ConfigurationSingle phase + GND[2]
  • Configuration200-240 vac, 50/60 Hz[2]
  • Full load6 amps[2]
  • Largest load1.5 amps[2]
  • Main Breaker20 Amps/10,000 AIC[4]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Not publicly documented

The following facts about the NSX 105 Automated Wafer, Die & Bump are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the NSX 105 Automated Wafer, Die & Bump are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the NSX 105 Automated Wafer, Die & Bump are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the NSX 105 Automated Wafer, Die & Bump are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the NSX 105 Automated Wafer, Die & Bump are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the NSX 105 Automated Wafer, Die & Bump is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (5)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]Inventory photo
  3. [3]Inventory photo
  4. [4]inventory listing
  5. [5]inventory listing
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Last updated Jul 29, 2026.

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