Onto Innovation
NSX 105 D Automated Wafer, Die & Bump
The ONTO / Rudolph / August NSX 105 D is an automated wafer, die, and bump inspection system. The NSX 105 D belongs to the NSX 105 family from Onto Innovation. The NSX 105 D requires single phase power with ground, 200-240 Vac, 50/60 Hz, a full load of 6 amps, and a largest load of 1.5 amps.[1][2]
What it is
The Onto Innovation NSX 105 D is an automated wafer, die, and bump inspection system. The NSX 105 D operates on single-phase power with a voltage range of 200 to 240 VAC at either 50 or 60 Hz. The NSX 105 D has a full load current rating of 6 amperes and a largest load rating of 1.5 amperes. The NSX 105 D is part of the NSX 105 family of instruments. The NSX 105 D was manufactured by Onto Innovation, with historical branding also associated with Rudolph and August.[1][2]
How it works
General reference — not yet source-verifiedAutomated wafer inspection systems use optical or laser sensors to scan the surface of a wafer. The system collects data on topographical features and surface defects such as scratches, contamination, or dimensional deviations.
Die inspection involves examining individual chip dies for structural integrity and surface quality. Bump inspection measures the height and shape of solder bumps used in flip-chip packaging, ensuring uniformity and proper contact area.
Where it fits in the process flow
General reference — not yet source-verifiedWafer, die, and bump inspection is performed after wafer fabrication steps such as polishing or after die cutting. Die and bump inspection typically occurs during the final stages of IC packaging, before functional testing or shipping.
Applications
General reference — not yet source-verifiedThe system is used for quality control in semiconductor manufacturing, including wafer defect detection, die sorting, and solder bump verification in ball grid array and flip-chip processes.
What do the numbers mean?
Power & electrical7
Configuration & options2
- 200-240 Vac[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the primary function of the NSX 105 D?
The NSX 105 D is an automated wafer, die, and bump inspection system.[1][2]
Not publicly documented
The following facts about the NSX 105 D Automated Wafer, Die & Bump are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the NSX 105 D Automated Wafer, Die & Bump are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the NSX 105 D Automated Wafer, Die & Bump are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the NSX 105 D Automated Wafer, Die & Bump are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the NSX 105 D Automated Wafer, Die & Bump are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the NSX 105 D Automated Wafer, Die & Bump is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 13, 2026.
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