Tool family
The Plasma-Therm 790 RIE-PECVD is a single-chamber reactive ion etcher / plasma-enhanced chemical vapor deposition system.
The Plasma-Therm 790 Series RIE is a reactive ion etcher for 6-inch wafers.
The Plasma-Therm Unaxis 790 is a reactive ion etcher / ICP plasma etch system used for etching polymer, dielectric, silicon, silicon oxide, and silicon nitride materials.
Cited variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Unaxis 790 Middle | — | — | NIST identifies this as a specific NanoFab tool location/variant designation. | nist.gov[1] |
| Unaxis 790 Right | — | — | NIST identifies this as a specific NanoFab tool location/variant designation. | nist.gov[2] |
| Plasma-Therm Unaxis 790 Dual Chamber Shuttle Load Lock System | — | 2001 | Described as a dual chamber shuttle load lock system with PC controller, no endpoint detection, AE RF 5S generator, eight gas inputs, and loadlock. | capovani.com[3] |
| Plasma-Therm Unaxis 790 DRIE PECVD | — | — | Described with DRIE and PECVD process capability and PC controller. | semistarcorp.com[4] |
The Plasmatherm / Unaxis 790 RIE is a reactive ion etcher specified for 6-inch wafers.
The Plasma-Therm 790 RIE-PECVD is a single-chamber reactive ion etcher / plasma-enhanced chemical vapor deposition system.
The Plasma-Therm 790 Series RIE is a reactive ion etcher for 6-inch wafers.
The Plasma-Therm Unaxis 790 is a reactive ion etcher / ICP plasma etch system used for etching polymer, dielectric, silicon, silicon oxide, and silicon nitride materials.
The Plasmatherm / Unaxis 790 RIE is a reactive ion etcher specified for 6-inch wafers.