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Plasma-Therm

Unaxis 790

EtchPlasma-Therm Unaxis 790 family
Research Quality: 40% complete
Plasma-ThermUnaxis 790
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How it works

The specified RF power capability is up to 500 W at 13.56 MHz, and the electrode temperature range is 0 °C to 70 °C. The chamber is large enough to accept substrates up to 200 mm in diameter and small pieces.[2][3]

Where it fits in the process flow

For this model, the supported wafer size reaches 200 mm, and small pieces are also supported. That makes it suitable for wafer-scale etching as well as smaller sample processing in a cleanroom environment.[2][3]

Applications

The tool is used for anisotropic thin-film etching, photoresist descum, and silicon nitride membrane fabrication. It is also used for reactive ion etching of silicon, silicon oxide, and silicon nitride.[2][3]

What do the numbers mean?

Power & electrical3

Phase
3 Phase[1]
Accurate?
Voltage
208 Vac[1]
Accurate?
50/60 Hz[1]
Accurate?

Configuration & options1

5 Wire[1]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
Unaxis 790 MiddleNIST identifies this as a specific NanoFab tool location/variant designation.nist.gov[2]
Unaxis 790 RightNIST identifies this as a specific NanoFab tool location/variant designation.nist.gov[3]
Plasma-Therm Unaxis 790 Dual Chamber Shuttle Load Lock System2001Described as a dual chamber shuttle load lock system with PC controller, no endpoint detection, AE RF 5S generator, eight gas inputs, and loadlock.capovani.com[4]
Plasma-Therm Unaxis 790 DRIE PECVDDescribed with DRIE and PECVD process capability and PC controller.semistarcorp.com[5]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Phase3 Phase[1]
  • Voltage208 Vac[1]
  • Configuration50/60 Hz[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What is the maximum wafer size supported?

The maximum wafer diameter is 200 mm, and small pieces are supported.[2][3]

Not publicly documented

The following facts about the Unaxis 790 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Unaxis 790 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the Unaxis 790 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the Unaxis 790 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the Unaxis 790 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the Unaxis 790 are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]nist.govnist.govnist.gov
  3. [3]nist.govnist.govnist.gov
  4. [4]capovani.comcapovani.comcapovani.com
  5. [5]semistarcorp.comsemistarcorp.comsemistarcorp.com
  6. [6]Plasmatherm Unaxis 790 | SemiStarsemistarcorp.comsemistarcorp.com
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Last updated Jul 30, 2026.

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