Advantest

T 5585

Test & Probe Advantest T 5585 family

Research Quality: 50% complete

T 5585 — Inventory photo — Fig. 01T 5585Inventory photo^[1]

Power

250/500 MHz (DDR mode)^[3]

Performance

±400 ps^[3]

What it is

General reference — not yet source-verified

Test and probe equipment is used in semiconductor electrical test flow to apply patterns, stimulate device pins, and measure responses before final assembly or at later package test stages. A tester of this class is typically paired with a prober for wafer-level contact or with package handling hardware for device-level screening and characterization.

Where it fits in the process flow

General reference — not yet source-verified

Test and probe tools sit after wafer fabrication has produced functional die and before devices move onward to assembly qualification, final electrical verification, or shipment release. In wafer sort use, a prober presents each die to the tester so bad die can be screened before packaging.

Applications

General reference — not yet source-verified

Memory testers are used for electrical verification of volatile and static memory products, including device bring-up, production screening, and characterization across programmed pattern sets. Such systems are used where parallel stimulus and response measurement are needed to evaluate memory array behavior and interface timing.

What do the numbers mean?

Power & electrical3

Test frequency: 250/500 MHz (DDR mode)^[3]
Programmable power supplies: 64 (standard), 192 (maximum)^[3]
Pattern generator: ALPG X16, Y16, D18×2^[3]

Wafer handling1

Wafer size: 8 inch^[4]

Performance1

Test timing accuracy: ±400 ps^[3]

Control & software1

HDD and Software included^[2]

Accurate?

Configuration & options20

Core Boards:^[2]; PPS Boards (Pattern Pin Supply) – BGR‑022365 (Qty 8 – dual head configuration)^[2]; CAL/SIG Board – BGR 024351^[2]; STRB GEN Board – BGR 024444^[2]; TGFC IF Board – BGR 024356^[2]; SC DIST Board – BGR 024362^[2]; SC IF Board – BGR 024361^[2]; SCU Backplane – BLZ 024360^[2]; Test Head VIO I/F – BGR 024353^[2]; Dummy PE Boards – BGR 025800^[2]
Target devices: SDRAM, DDR-SDRAM, SSRAM^[3]
Max simultaneous test count: 256 (128 × 2 stations × 8/9 bit)^[3]
DC test units: 32 (standard), 64 (maximum)^[3]
Options: DBM, AFM, PM^[3]
Make: Advantest^[1]
Model: T 5585^[1]
Equipment type: Tester^[1]
Core boards: PPS Boards (Pattern Pin Supply) – BGR‑022365 (Qty 8, dual head configuration); CAL/SIG Board – BGR 024351; STRB GEN Board – BGR 024444; TGFC IF Board – BGR 024356; SC DIST Board – BGR 024362; SC IF Board – BGR 024361; SCU Backplane – BLZ 024360; Test Head VIO I/F – BGR 024353; Dummy PE Boards – BGR 025800^[2]
Vintage: 2001^[2]
Vintage: 2002^[4]

Vintage & configurations

Documented models & variants

Designation	Generation	Vintage	Changes	Source
T5586	—	—	Adds a Tracing Check function for precisely measuring output timing of devices with jitter	web.archive.org^[3]

Interested in this tool?

Need help with this tool?Embed spec card

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Test frequency250/500 MHz (DDR mode)^[3]
Programmable power supplies64 (standard), 192 (maximum)^[3]
Pattern generatorALPG X16, Y16, D18×2^[3]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Worked with this tool? Help preserve its knowledge →

Frequently asked questions

How does the tester connect to the device under test?General reference — not yet source-verified

At wafer level the tester connects through a probe card on a prober; for packaged parts it uses a test socket on a handler. The test head provides the contact interface in both cases.

What kinds of measurements can be performed?General reference — not yet source-verified

The system performs functional read and write tests as well as parametric measurements of supply current, output levels, leakage, timing margins, and other electrical characteristics.

Can equipment of this class be used outside production?General reference — not yet source-verified

Yes. Machines of this class are also used in engineering characterization and failure analysis to understand device behavior and support yield improvement.

Not publicly documented

The following facts about the T 5585 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the T 5585 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the T 5585 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the T 5585 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the T 5585 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the T 5585 are on record.
Answerable by: an OEM parts catalog or a service engineer