AJA

Q2

Research Quality: 40% complete

Q2 — cnfusers.cornell.edu — Fig. 01Q2cnfusers.cornell.edu^[1]

What is it?

The AJA Quantum Materials Sputter Deposition System is described as a loadlocked UHV sputter deposition system for quantum devices. The source states that it has both RF and DC sputtering capability, RF substrate pre-treatment, an in-chamber ion source for substrate cleaning, two sputter guns for deposition, and two manually adjustable off-axis sputter guns for low-energy sputter deposition.

What can it run?

Process applications and technology nodes documented for this tool.

quantum computing research
creation of next generation quantum devices
sputter deposition

What do the numbers mean?

Power & electrical2

Sputtering capability: RF and DC sputtering capability^[1]
Substrate pre-treatment: RF substrate pre-treatment^[1]

Wafer handling2

Tool type: loadlocked UHV sputter deposition system^[1]
Substrate cleaning: in chamber ion source for substrate cleaning^[1]

Configuration & options6

System name: AJA Quantum Materials Sputter Deposition System^[1]
Tool location: 106^[1]
Compatibility: 1E - Silicon Based Materials and Select Dieletrics^[1]
Sputter guns: two sputter guns for deposition of various materials^[1]
Off-axis sputter guns: two manually adjustable off axis sputter guns for low energy sputter deposition^[1]
Primary materials: Aluminum, Niobium, Tantalum and Titanium^[1]

Interested in this tool?

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Sputtering capabilityRF and DC sputtering capability^[1]
Substrate pre-treatmentRF substrate pre-treatment^[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the Q2 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Q2 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Q2 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Q2 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Q2 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Q2 is not on record.
Answerable by: an OEM datasheet or a fab qualification report