AJA
The AJA Q2 is a loadlocked UHV sputter deposition system. The AJA Q2 has RF and DC sputtering capability. The AJA Q2 includes an in-chamber ion source for substrate cleaning.[1][2]

The AJA Q2 has RF and DC sputtering capability.[1][2]
The AJA Q2 includes RF substrate pre-treatment and an in-chamber ion source for substrate cleaning.[1][2]
The AJA Q2 belongs in thin-film deposition after substrate preparation and before later patterning or device fabrication steps.
The AJA Q2 supports deposition of films for device structures that require controlled material layers.
The AJA Q2 is used for quantum materials work.[1]
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The following facts about the Q2 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Q2 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Q2 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Q2 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Q2 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Q2 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 20, 2026.
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