Angstrom Engineering

NexDep

Deposition Angstrom Engineering NexDep family

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NexDep — pnf.uchicago.edu — Fig. 01NexDeppnf.uchicago.edu^[1]

Plate 01The Angstrom Engineering Nexdep Electron Beam Evaporation System
AZoNetworkWatch on YouTube

Power

3 kW^[1]

Vacuum

High aluminum high vacuum box chamber^[1]

What is it?

The Angstrom NexDep Thermal E-Beam Evaporator is described as a PVD tool for e-beam and thermal evaporation for a variety of high melting point substrates. The source states that NexDep 1 supports principal e-beam and thermal evaporation, while NexDep 2 supports principal e-beam, thermal evaporation, and ion assisted deposition.

What can it run?

Process applications and technology nodes documented for this tool.

Electronic and optical semiconductor films
Wear resistant and thermal barrier coatings
Hard coatings for tools

What do the numbers mean?

Power & electrical1

Power supply: 3 kW^[1]

Vacuum & pumping2

Chamber type: High aluminum high vacuum box chamber^[1]
Base pressure: < 5 x 10^-7 Torr in a clean system^[1]

Control & software2

Control: PC control station with fully automated sequences and software for deposition control^[1]
Multi-layer control: Multi-layer deposition control^[1]

Dimensions & facilities1

Chamber dimensions: 16" x 16" x 28"^[1]

Configuration & options3

E-Beam pocket configuration: 6 x 7 cc multi-pocket E-Beam^[1]
Evaporation sources: Dual resistive evaporation sources^[1]
Deposition modes: Combined co-deposition processing with e-beam and thermal or thermal and thermal processing; not e-beam and e-beam processing^[1]

Vintage & configurations

Documented models & variants

Designation	Generation	Vintage	Changes	Source
NexDep 1	—	—	Configured for principal e-beam and thermal evaporation.	pnf.uchicago.edu^[1]
NexDep 2	—	—	Configured for principal e-beam, thermal evaporation, and ion assisted deposition.	pnf.uchicago.edu^[1]

Interested in this tool?

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Chamber typeHigh aluminum high vacuum box chamber^[1]
Base pressure< 5 x 10^-7 Torr in a clean system^[1]
Power supply3 kW^[1]

Where are the manuals?

Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.

Angstrom Rev-1.pdfDocumentumd.edu

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Not publicly documented

Field notes

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Not publicly documented

The following facts about the NexDep are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the NexDep are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the NexDep are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the NexDep are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the NexDep is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the NexDep are on record.
Answerable by: an OEM parts catalog or a service engineer

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (3)Every fact above is drawn from these public sources

[1]pnf.uchicago.edu — pnf.uchicago.edupnf.uchicago.edu
[2]Evaporator: thermal [ANGSTROM-Thermal] | Quantum-Nano Fabrication and Characterization Facility | University of Waterloo — uwaterloo.cauwaterloo.ca
[3]Angstrom Rev-1.pdf — nanocenter.umd.edunanocenter.umd.edu