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Applied Materials

CENG 2 Dry

Etch
Research Quality: 30% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The Applied Materials CENG 2 is a dry etcher used in semiconductor manufacturing.[1]

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What it is

The Applied Materials CENG 2 is a dry etcher.[1]

How it works

General reference — not yet source-verified

Dry etching operates by generating a plasma from process gases inside a vacuum chamber. The plasma produces reactive species and ions that etch exposed material on the wafer, either through chemical reactions (reactive ion etching) or physical sputtering.

The system uses radio-frequency power to sustain the plasma and control etch directionality. The etch chemistry is selected based on the material to be removed, such as silicon dioxide, silicon nitride, or metals.

Where it fits in the process flow

General reference — not yet source-verified

Dry etchers are used in semiconductor fabrication after photolithography to transfer patterns into underlying layers. The etched patterns define transistor structures, interconnect lines, and other device features.

What do the numbers mean?

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Where are the manuals?

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Not publicly documented

Field notes

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Not publicly documented

The following facts about the CENG 2 Dry are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No specifications for the CENG 2 Dry are on record.

    Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the CENG 2 Dry are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the CENG 2 Dry are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the CENG 2 Dry are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the CENG 2 Dry are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

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Sources & citations

Sources (1)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
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Last updated Aug 20, 2026.

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