Applied Materials
Centura 5200 Dielectric
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
General reference — not yet source-verifiedDielectric etch systems remove insulating films from wafers by plasma-based dry etching. Dielectric etch tools are typically used to pattern layers such as oxide or nitride after lithography has defined where material should remain.
How it works
General reference — not yet source-verifiedPlasma dielectric etchers generally place wafers in a vacuum process chamber, introduce reactive gases, ignite a plasma, and use ion-assisted chemical reactions to remove selected dielectric material. Cluster etch platforms generally move wafers through load locks and transfer modules so the wafer can be processed under controlled vacuum without repeated exposure between steps.
Where it fits in the process flow
General reference — not yet source-verifiedDielectric etch tools normally operate after a dielectric film has been deposited and after a patterned mask has been formed by lithography. Dielectric etch tools normally feed downstream steps such as resist stripping, cleaning, dielectric refill, metallization, or additional pattern-transfer sequences, depending on the device structure.
What do the numbers mean?
Wafer handling1
Configuration & options5
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What type of equipment is the Applied Materials Centura 5200 Dielectric?
The Applied Materials Centura 5200 Dielectric is a dielectric etch system made by Applied Materials.[2]
Not publicly documented
The following facts about the Centura 5200 Dielectric are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Centura 5200 Dielectric are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Centura 5200 Dielectric are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Centura 5200 Dielectric are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Centura 5200 Dielectric are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Centura 5200 Dielectric is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]Centura 5200 Dielectric — Applied Materials | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 17, 2026.
Compare with similar tools
View all →The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.
Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.
