Applied Materials
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The Applied Materials Centura I P 1 is an oxide etcher for 6-inch wafers. The Centura I P 1 features two chambers and MxP+ configuration.[1]
The Centura series is a multi-chamber cluster platform used in semiconductor fabrication. The system employs a vacuum load lock and a central robot to transfer wafers between chambers under vacuum.
Plasma etching in the Centura I P 1 removes material through chemical and physical interactions between a radio-frequency generated plasma and the wafer surface.
The cluster architecture allows sequential processing in dedicated chambers without breaking vacuum, improving throughput and process control.
Oxide etching is typically performed after lithographic patterning to open contact holes or via structures in the interlayer dielectric.
The etch step is followed by photoresist stripping and wet cleaning to remove residues before subsequent deposition or metallization.
The Centura I P 1 etcher is configured for oxide etching.[1]
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The following facts about the Centura I P 1 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Centura I P 1 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Centura I P 1 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Centura I P 1 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Centura I P 1 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Centura I P 1 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Aug 14, 2026.