Waferpedia

Tool family

Applied Materials Centura

Applied MaterialsEtch27 entries

Models in this family

  1. Applied Materials Centura is a deposition system used to form thin films on substrates in semiconductor manufacturing. It belongs to the class of vacuum process tools used to build functional layers during device fabrication.

    Cited variants

    DesignationGenerationVintageChangesSource
    Ultima+ HDP2002Equipment inventory listing[1]
    3 C/H, DxZ2000Equipment inventory listing[2]
    SIGEN 4CHEquipment inventory listing[3]
    Centura CVD (Chemical Vapor Deposition)2000Listed with product details including 8" Ultima+ HDP, 8" 3 C/H DxZ, and 12" SIGEN 4CH.Equipment inventory listing[1]
    Centura Etcher2003Listed as an etcher variant with 12" wafer size and EMAX CT Plus.Equipment inventory listing[4]
  2. Applied Materials Centura 5300 Omega HDP Dry Etcher is an 8-inch dry etcher with 2 channels for SiO2 D/E CH-A/B.

  3. Applied Materials Centura AP AdvantEdge G 5 is a dry etcher with three chambers and listed process gases for Chambers A, B, and D.

  4. Applied Materials Centura AP Enabler Dielectric Etcher is a 300 mm dielectric etcher with GEM/CIM JGJ online connection and a 3 carrier stage interface.

  5. Cited variants

    DesignationGenerationVintageChangesSource
    Centura DPSIdentified in the sources as a Centura DPS Etcher; one source notes chambers only, no loadport, with 9 chambers listed as 4 incomplete but okay condition and 5 parts.Equipment inventory listing[5]
  6. The Applied Materials Centura DPS+ Poly Silicon Etcher is a 6-inch wafer etching system with multiple DPS Plus chambers.

  7. Applied Materials Centura Dry Etcher is a 3-chamber Ultima dry etcher with 1 cool down and 1 orienter/degas, using BCL3, C2, SF6, He, and Ar gases.

  8. Applied Materials Centura DxZ is a CVD (Chemical Vapor Deposition) equipment line.

  9. Applied Materials Centura HP is a PVD (Physical Vapor Deposition) system for 8-inch wafers.

  10. Applied Materials Centura I DPS Poly is an etcher with two DPS Poly chambers and 8-inch wafer size support.

  11. The Applied Materials Centura I P 1 is an oxide etcher for 6-inch wafers.

  12. Applied Materials Centura I P 2 DPS is a Decoupled Plasma Source deposition system for 8-inch wafers.

    Cited variants

    DesignationGenerationVintageChangesSource
    Centura I P 2 DPS, 8" R1 Metal 2CH ASP+ 2CH 2002 Vintage2002The source states this example is a 2002 vintage unit and includes the descriptors 8" R1 Metal 2CH ASP+ 2CH.Equipment inventory listing[6]
    Centura I P 2 DPS, 8" R1 Metal 2CH ASP+ 2CH 2000 Vintage2000The source states this example is a 2000 vintage unit and includes the descriptors 8" R1 Metal 2CH ASP+ 2CH.Equipment inventory listing[7]
  13. The Applied Materials Centura I Phase II Oxide Etcher (also known as the 5200 Centura I Phase II) is an oxide etcher configured for 6-inch wafers with an upgrade path to 200 mm wafers.

  14. Applied Materials Centura II eMax is an etcher with 8-inch wafer size and 4x eMax chambers.

  15. The Applied Materials Centura Ultima+ HDP is a chemical vapor deposition system for 6-inch wafers, equipped with an ENI AM200 RF generator.

All entries

  1. CenturaApplied Materials

    General referenceApplied Materials Centura is a deposition system used to form thin films on substrates in semiconductor manufacturing. It belongs to the class of vacuum process tools used to build functional layers during device fabrication.

    CategoryDeposition
    4 specs
  2. Centura 1 P 2Applied Materials
    6 specs
  3. Centura 4.0 DPNApplied Materials
    CategoryDeposition
    1 spec
  4. Centura 5300 Omega HDP DryApplied Materials

    Applied Materials Centura 5300 Omega HDP Dry Etcher is an 8-inch dry etcher with 2 channels for SiO2 D/E CH-A/B.

    CategoryEtch
    1 spec
  5. Centura AP AdvantEdge G 5 DryApplied Materials

    Applied Materials Centura AP AdvantEdge G 5 is a dry etcher with three chambers and listed process gases for Chambers A, B, and D.

    CategoryEtch
    10 specs
  6. Centura AP Enabler DielectricApplied Materials

    Applied Materials Centura AP Enabler Dielectric Etcher is a 300 mm dielectric etcher with GEM/CIM JGJ online connection and a 3 carrier stage interface.

    CategoryEtchWaferDiameter 300+/- 0.05mm(SEMI M28), 775 +/- 25um, Notch
    20 specs
  7. Centura DPHeApplied Materials
    CategoryDeposition
    2 specs
  8. Centura DPS+Applied Materials
    CategoryEtch
    8 specs
  9. Centura DPS+ Poly SiliconApplied Materials

    The Applied Materials Centura DPS+ Poly Silicon Etcher is a 6-inch wafer etching system with multiple DPS Plus chambers.

    CategoryEtchWaferWafer Mapping
    31 specs
  10. Centura DryApplied Materials

    Applied Materials Centura Dry Etcher is a 3-chamber Ultima dry etcher with 1 cool down and 1 orienter/degas, using BCL3, C2, SF6, He, and Ar gases.

    CategoryEtch
    4 specs
  11. Centura DxZApplied Materials

    Applied Materials Centura DxZ is a CVD (Chemical Vapor Deposition) equipment line.

    CategoryDeposition
    5 specs
  12. Centura eMax NitrideApplied Materials
    CategoryEtch
    13 specs
  13. Centura eMXP+Applied Materials
    CategoryEtch
    11 specs
  14. Centura Enabler OxideApplied Materials
    CategoryEtch
    2 specs
  15. Centura HPApplied Materials

    Applied Materials Centura HP is a PVD (Physical Vapor Deposition) system for 8-inch wafers.

    CategoryDeposition
    4 specs
  16. Centura HTFApplied Materials
    CategoryDeposition
    2 specs
  17. Centura I DPS PolyApplied Materials

    Applied Materials Centura I DPS Poly is an etcher with two DPS Poly chambers and 8-inch wafer size support.

    CategoryEtch
    8 specs
  18. Centura I P 1Applied Materials

    The Applied Materials Centura I P 1 is an oxide etcher for 6-inch wafers.

    CategoryEtch
    6 specs
  19. Centura I P 2 DPSApplied Materials

    Applied Materials Centura I P 2 DPS is a Decoupled Plasma Source deposition system for 8-inch wafers.

    CategoryDeposition
    1 spec
  20. Centura I Phase II OxideApplied Materials

    The Applied Materials Centura I Phase II Oxide Etcher (also known as the 5200 Centura I Phase II) is an oxide etcher configured for 6-inch wafers with an upgrade path to 200 mm wafers.

    CategoryEtch
    6 specs
  21. Centura IIApplied Materials
    CategoryEtch
    1 spec
  22. Centura II eMaxApplied Materials

    Applied Materials Centura II eMax is an etcher with 8-inch wafer size and 4x eMax chambers.

    CategoryEtch
    1 spec
  23. Centura RTPApplied Materials
    CategoryThermal / Diffusion
    2 specs
  24. Centura Super EApplied Materials
    CategoryEtch
    2 specs
  25. Centura TectraApplied Materials
    CategoryEtch
    1 spec
  26. Centura Ultima+ HDPApplied Materials

    The Applied Materials Centura Ultima+ HDP is a chemical vapor deposition system for 6-inch wafers, equipped with an ENI AM200 RF generator.

    CategoryDeposition
    22 specs
  27. Centura WxZApplied Materials
    CategoryDeposition
    2 specs

Sources

Sources (7)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing
  3. [3]Equipment inventory listing
  4. [4]Equipment inventory listing
  5. [5]Equipment inventory listing
  6. [6]Equipment inventory listing
  7. [7]Equipment inventory listing