Tool family
Applied Materials Centura is a deposition system used to form thin films on substrates in semiconductor manufacturing. It belongs to the class of vacuum process tools used to build functional layers during device fabrication.
Cited variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Ultima+ HDP | — | 2002 | — | Equipment inventory listing[1] |
| 3 C/H, DxZ | — | 2000 | — | Equipment inventory listing[2] |
| SIGEN 4CH | — | — | — | Equipment inventory listing[3] |
| Centura CVD (Chemical Vapor Deposition) | — | 2000 | Listed with product details including 8" Ultima+ HDP, 8" 3 C/H DxZ, and 12" SIGEN 4CH. | Equipment inventory listing[1] |
| Centura Etcher | — | 2003 | Listed as an etcher variant with 12" wafer size and EMAX CT Plus. | Equipment inventory listing[4] |
Applied Materials Centura 5300 Omega HDP Dry Etcher is an 8-inch dry etcher with 2 channels for SiO2 D/E CH-A/B.
Applied Materials Centura AP AdvantEdge G 5 is a dry etcher with three chambers and listed process gases for Chambers A, B, and D.
Applied Materials Centura AP Enabler Dielectric Etcher is a 300 mm dielectric etcher with GEM/CIM JGJ online connection and a 3 carrier stage interface.
Cited variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Centura DPS | — | — | Identified in the sources as a Centura DPS Etcher; one source notes chambers only, no loadport, with 9 chambers listed as 4 incomplete but okay condition and 5 parts. | Equipment inventory listing[5] |
The Applied Materials Centura DPS+ Poly Silicon Etcher is a 6-inch wafer etching system with multiple DPS Plus chambers.
Applied Materials Centura Dry Etcher is a 3-chamber Ultima dry etcher with 1 cool down and 1 orienter/degas, using BCL3, C2, SF6, He, and Ar gases.
Applied Materials Centura DxZ is a CVD (Chemical Vapor Deposition) equipment line.
Applied Materials Centura HP is a PVD (Physical Vapor Deposition) system for 8-inch wafers.
Applied Materials Centura I DPS Poly is an etcher with two DPS Poly chambers and 8-inch wafer size support.
The Applied Materials Centura I P 1 is an oxide etcher for 6-inch wafers.
Applied Materials Centura I P 2 DPS is a Decoupled Plasma Source deposition system for 8-inch wafers.
Cited variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Centura I P 2 DPS, 8" R1 Metal 2CH ASP+ 2CH 2002 Vintage | — | 2002 | The source states this example is a 2002 vintage unit and includes the descriptors 8" R1 Metal 2CH ASP+ 2CH. | Equipment inventory listing[6] |
| Centura I P 2 DPS, 8" R1 Metal 2CH ASP+ 2CH 2000 Vintage | — | 2000 | The source states this example is a 2000 vintage unit and includes the descriptors 8" R1 Metal 2CH ASP+ 2CH. | Equipment inventory listing[7] |
The Applied Materials Centura I Phase II Oxide Etcher (also known as the 5200 Centura I Phase II) is an oxide etcher configured for 6-inch wafers with an upgrade path to 200 mm wafers.
Applied Materials Centura II eMax is an etcher with 8-inch wafer size and 4x eMax chambers.
The Applied Materials Centura Ultima+ HDP is a chemical vapor deposition system for 6-inch wafers, equipped with an ENI AM200 RF generator.
General referenceApplied Materials Centura is a deposition system used to form thin films on substrates in semiconductor manufacturing. It belongs to the class of vacuum process tools used to build functional layers during device fabrication.
Applied Materials Centura 5300 Omega HDP Dry Etcher is an 8-inch dry etcher with 2 channels for SiO2 D/E CH-A/B.
Applied Materials Centura AP AdvantEdge G 5 is a dry etcher with three chambers and listed process gases for Chambers A, B, and D.
Applied Materials Centura AP Enabler Dielectric Etcher is a 300 mm dielectric etcher with GEM/CIM JGJ online connection and a 3 carrier stage interface.
The Applied Materials Centura DPS+ Poly Silicon Etcher is a 6-inch wafer etching system with multiple DPS Plus chambers.
Applied Materials Centura Dry Etcher is a 3-chamber Ultima dry etcher with 1 cool down and 1 orienter/degas, using BCL3, C2, SF6, He, and Ar gases.
Applied Materials Centura DxZ is a CVD (Chemical Vapor Deposition) equipment line.
Applied Materials Centura HP is a PVD (Physical Vapor Deposition) system for 8-inch wafers.
Applied Materials Centura I DPS Poly is an etcher with two DPS Poly chambers and 8-inch wafer size support.
The Applied Materials Centura I P 1 is an oxide etcher for 6-inch wafers.
Applied Materials Centura I P 2 DPS is a Decoupled Plasma Source deposition system for 8-inch wafers.
The Applied Materials Centura I Phase II Oxide Etcher (also known as the 5200 Centura I Phase II) is an oxide etcher configured for 6-inch wafers with an upgrade path to 200 mm wafers.
Applied Materials Centura II eMax is an etcher with 8-inch wafer size and 4x eMax chambers.
The Applied Materials Centura Ultima+ HDP is a chemical vapor deposition system for 6-inch wafers, equipped with an ENI AM200 RF generator.