Applied Materials
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A dry etcher removes material by exposing a wafer to a controlled plasma or reactive gas environment rather than by using liquid chemistries.
A dry etcher uses process gases, plasma conditions, chamber geometry, and endpoint control to shape etch directionality and selectivity.
The Applied Materials eMax CT Plus Dry belongs in the wafer pattern-transfer portion of semiconductor manufacturing.
The Applied Materials eMax CT Plus Dry is used after lithographic patterning and before later cleaning, inspection, or downstream fabrication steps.
The Applied Materials eMax CT Plus Dry is used for dry etching of silicon nitride.[2]
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The following facts about the eMax CT Plus Dry are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the eMax CT Plus Dry are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the eMax CT Plus Dry are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the eMax CT Plus Dry are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the eMax CT Plus Dry are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the eMax CT Plus Dry is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 13, 2026.
The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.
Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.