Applied Materials
P 5000 Mark II
Wafer size
Wafer Orienter
Introduced
1991
Power
RF Generator Rack[1]
Vacuum
Edwards iH 80 Series[1]
Gas delivery
28[1]
What it is
General reference — not yet source-verifiedThe Applied Materials P 5000 Mark II belongs to the deposition class of process equipment. Such machines are used to place a material layer onto a substrate in a controlled vacuum or process environment, creating films that become part of an electrical, optical, or protective stack.
Machines of this class are a core part of thin-film manufacturing. They are built to produce repeatable coatings with controlled uniformity and adhesion so that downstream patterning, etching, or finishing steps can rely on a consistent starting surface.
How it works
General reference — not yet source-verifiedThe process is managed by controlling chamber conditions, substrate exposure, and the delivery of the film-forming material. By adjusting these parameters, machines of this class can form films with different compositions, thickness behaviors, and physical properties suited to the intended process.
Where it fits in the process flow
General reference — not yet source-verifiedDeposition equipment is used early or midstream in the fabrication flow, after surface preparation and before pattern definition, etching, or other structuring steps that shape the deposited material into device features.
Applications
General reference — not yet source-verifiedMachines of this class are generally used to create conductive, insulating, barrier, protective, or functional thin films on wafers and other precision substrates. These films support semiconductor devices, interconnect structures, optical coatings, and related layered products.
- PECVD
What do the numbers mean?
Power & electrical2
- RF Generator Rack[1]
Vacuum & pumping1
Wafer handling4
- Center finder board retrofitted for transparent & opaque substrates[1]
Gas & chemistry2
- CES Gas Panel[1]
Control & software3
- Mini Controller[1]
Configuration & options17
- DxZ[7]
- DxL[8]
- Refurbished[1]
- Silane PECVD[1]
- All cables present[1]
- Bolt Down Lid[1]
- Expanded (21 Slot) VME[1]
- Remote Frame w/AC Box[1]
- Applied Materials Heat Exchanger[1]
- No CE Mark[1]
- 3 CVD (PSG USG)[11]
- 2 WxZ, 2 WxP[12]
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| P 5000 Mark II PECVD, 8" DxZ | — | — | — | Equipment inventory listing[7] |
| P 5000 Mark II PECVD, 8" DxL | — | — | — | Equipment inventory listing[8] |
| P 5000 Mark II PECVD, 8" | — | 1991 | Software: b6.02; 1991 Vintage. | Equipment inventory listing[9] |
| P 5000 Mark II PECVD, 6" | — | 2010 | Described as refurbished; includes a Wafer Orienter, Phase 3 Robot, Phase 3 Cassette Handler, and other listed hardware/options. | Equipment inventory listing[1] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What does a deposition system do?General reference — not yet source-verified
It forms a thin material layer on a substrate under controlled process conditions.
Why is deposition important in fabrication?General reference — not yet source-verified
It creates the base layers and functional films that later process steps shape into the final device.
What kinds of films do machines of this class make?General reference — not yet source-verified
They are used for conductive, insulating, barrier, protective, and other functional thin films.
Where does deposition sit in the process flow?General reference — not yet source-verified
It is typically performed after substrate preparation and before patterning or other structuring operations.
What kind of substrates can this class handle?General reference — not yet source-verified
Machines of this class are used for semiconductor and precision-optics substrates that require controlled thin-film layers.
Not publicly documented
The following facts about the P 5000 Mark II are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the P 5000 Mark II are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the P 5000 Mark II are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the P 5000 Mark II are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the P 5000 Mark II is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the P 5000 Mark II are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (14)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]Inventory photo
- [6]Inventory photo
- [7]inventory listing
- [8]inventory listing
- [9]inventory listing
- [10]inventory listing
- [11]inventory listing
- [12]inventory listing
- [13]inventory listing
- [14]inventory listing
Last updated Jul 30, 2026.
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