Waferpedia

Wafer size

8"

15 entries

  1. F50-UVFilmetrics

    The Filmetrics F50-UV is a thin-film metrology tool that measures film thickness via spectroscopic reflectometry and can generate thickness uniformity maps.

    CategoryMetrology & InspectionWafer8"
  2. NV GSD HEAxcelis

    The Axcelis NV GSD HE is an ion implantation system that can handle 6-inch and 8-inch wafers.

    CategoryIon ImplantationWafer8"
  3. Inspex EagleKLA

    The KLA Inspex Eagle Tester is a wafer handling and inspection system with 6-inch chuck and prealigner, 4-inch to 8-inch wafer capability, cassette-to-cassette handling, two ports, and a Zeiss microscope.

    CategoryTest & ProbeWafer8"
  4. NS 300 + WaferTokyo Electron

    Tokyo Electron NS 300 + Wafer Scrubber is a wet-process wafer scrubber for 8-inch wafers.

    CategoryWet Processing / CleanWafer8"
  5. Plasmalab 80 Plus RIEOxford Instruments

    Oxford Instruments Plasmalab 80 Plus RIE is a reactive ion etcher with support for wafers up to 8 inches.

    CategoryEtchWafer8"
  6. Siplace CA 4 WaferASM

    ASM Siplace CA 4 Wafer is an 8-inch wafer system described as a high-volume chip assembly and 4-portal microchip/SMD hybrid assembly system.

    Wafer8"
  7. VHEAxcelis

    The Axcelis VHE is an ion implanter described as a 6"-8" wafer convertible system.

    CategoryIon ImplantationWafer8"
  8. 2100 HSEsec
    CategoryPackaging & BondingWafer8"
  9. 635Denton Vacuum

    The Denton Vacuum 635 is a sputter deposition tool with four confocal cathodes, an 8-inch diameter stage, and configurable DC, RF, and reactive sputtering capabilities.

    CategoryDepositionWafer8"
  10. M1MRSI
    Wafer8"
  11. 2300Lam Research

    General referenceLam Research 2300 is an etch system used for pattern transfer in semiconductor processing. It belongs to the class of plasma-based etch equipment used to remove selected material from a wafer according to a patterned mask.

    CategoryEtchWafer8"
  12. AD 838ASM

    The ASM AD 838 is an 8-inch-wafer die bonder with epoxy dispensing and no stack input, operating on single-phase 220 Vac at 50/60 Hz.

    CategoryPackaging & BondingWafer8"
  13. KR15Disco

    The Disco KR15 is a 200-micron-thick, low-grit dicing blade used for cutting sapphire, glass, and silicon samples.

    CategoryDicing & GrindingWafer8"
  14. Rainbow 4520Lam Research

    Lam Research Rainbow 4520 is a single-wafer plasma/RIE etching system described as part of the Rainbow 45XX series.

    CategoryEtchWafer8"
  15. WS-650Mz-8NPPBLaurell

    The Laurell WS-650Mz-8NPPB is a spin coater that can take up to 8 inch wafers and go up to 10000 rpm.

    CategorySpin CoaterWafer8"