ASML
5500 300 C
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The ASML PAS 5500/300C is a deep ultraviolet (DUV) lithography stepper that handles 8-inch wafers. The ASML PAS 5500/300C processes 88 200 mm wafers per hour. The ASML PAS 5500/300C incorporates an AERIAL Illuminator that allows extendibility beyond 0.25 µm.[1]
What it is
General reference — not yet source-verifiedA lithography stepper projects a patterned mask image onto photoresist-coated wafers. A stepper is used during photolithography to define repeating device features across the wafer surface. Lithography tools of this class occupy the pattern-transfer stage between resist coating and resist development.
How it works
General reference — not yet source-verifiedA stepper exposes one field at a time and then repositions the wafer to repeat the pattern across the substrate. A lithography stepper uses projection optics to transfer the reticle pattern onto the resist with controlled focus and alignment. A DUV stepper uses deep ultraviolet exposure light for fine-feature optical patterning.
Where it fits in the process flow
General reference — not yet source-verifiedA lithography stepper is used after wafer cleaning, priming, and photoresist coating. A lithography stepper is used before post-exposure processing, development, and the subsequent etch, implant, or deposition pattern-transfer step. Alignment capability in this tool class supports layer-to-layer registration during repeated patterning cycles in semiconductor fabrication.
Applications
General reference — not yet source-verifiedLithography steppers are used to define device layers in integrated circuit manufacturing. Lithography steppers can pattern resist for later transfer into films by etching or for selective modification by implantation or lift-off style flows. DUV steppers are suited to layers that require finer optical pattern definition than older broad-spectrum exposure methods.
What do the numbers mean?
Wafer handling9
Optics & imaging8
Control & software5
Configuration & options5
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| PAS 5500/300C | DUV | — | Capable of processing 88 200 mm wafers per hour and incorporates an AERIAL Illuminator. | web.archive.org[1] |
Where are the manuals?
Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.
- DUV Resist InformationDocumentcornell.edu
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wafer size does the ASML 5500 300 C handle?
The ASML 5500 300 C handles 8 inch wafers.[2]
Not publicly documented
The following facts about the 5500 300 C are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 5500 300 C are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 5500 300 C are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 5500 300 C are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 5500 300 C is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 5500 300 C are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]web.archive.org — asml.com (Jan 25, 2006)web.archive.org
- [2]Inventory photo
- [3]Equipment Resources | CNF — cnf.cornell.educnf.cornell.edu
Last updated Oct 19, 2026.
Compare with similar tools
View all →Brooks 017-0146-01 is a prealigner manufactured by Brooks.
The Ultratech 1000 Family is a photolithography step-and-repeat 1X steppers family using the Wynne Dyson optical design.
The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.
