ASML

In a semiconductor fabrication facility, the Twinscan XT 1400 F ArF is used in the lithography step. The machine is positioned after photoresist coating and before post-exposure bake and development. The scanner is employed for critical and semi-critical layers in the integrated circuit manufacturing flow.
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The process module is configured for 200 millimeter wafers.[1][2]
Yes, the scanner includes a conversion kit for 300 millimeter wafers.[1][2]
The scanner operates on 50/60 Hz, 3-phase power at 230/400 VAC, with a power rating of 49 kVA. Full load current is 79 A per phase, largest load is 27 A per phase, and maximum interrupt capacity is 35 kA.[1][2]
The scanner is part of the ASML Twinscan XT 1400 family.[3]
The following facts about the Twinscan XT 1400 F ArF are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Twinscan XT 1400 F ArF are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Twinscan XT 1400 F ArF are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Twinscan XT 1400 F ArF are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Twinscan XT 1400 F ArF are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Twinscan XT 1400 F ArF is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 11, 2026.
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