Canon
FPA 3000 i 5
The Canon FPA 3000 i 5 is a stepper for semiconductor wafer processing. The FPA 3000 i 5 + variant supports 8-inch wafers with notch alignment and L-type transfer. The FPA 3000 i 5 + runs software version V13.06B.06.[1]
What it is
General reference — not yet source-verifiedA lithography stepper projects a patterned reticle image onto photoresist on a wafer. A stepper exposes one field at a time and moves the wafer between exposures to build up the full pattern across the wafer surface.
How it works
General reference — not yet source-verifiedLithography steppers align the wafer to the optical patterning system before exposure. Lithography steppers transfer the reticle pattern into photoresist by controlled exposure, and then repeat that exposure sequence across successive wafer fields.
Where it fits in the process flow
General reference — not yet source-verifiedLithography tools sit in the pattern transfer portion of wafer fabrication after resist coating and prebake. Lithography exposure is followed by post-exposure processing and development, after which the patterned resist is used in subsequent etch, implant, deposition, or lift-off sequences depending on the process module.
Applications
General reference — not yet source-verifiedSteppers are used to print repeated patterns for integrated circuit and related microfabrication layers. Steppers are applied wherever a process flow needs precise reticle-defined patterning in photoresist before downstream pattern transfer.
What do the numbers mean?
Wafer handling7
Optics & imaging2
Control & software1
Configuration & options6
- Rasco TBW-CD-83 + Compact Chamber[2]
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| FPA 3000 i 5 + | — | — | Intended for 8-inch wafers with notch alignment and L-type transfer; uses Canon's reticle cassette; no additional reticle library; no PPC unit; software version V13.06B.06; some units include a Rasco TBW-CD-83 transfer module with Compact Chamber (2000 vintage). | Equipment inventory listing[1] |
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What type of equipment is the Canon FPA 3000 i 5?
The Canon FPA 3000 i 5 is a stepper.[3]
Not publicly documented
The following facts about the FPA 3000 i 5 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the FPA 3000 i 5 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the FPA 3000 i 5 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the FPA 3000 i 5 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the FPA 3000 i 5 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the FPA 3000 i 5 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Equipment inventory listing
- [4]Equipment inventory listing
Last updated Oct 16, 2026.
Compare with similar tools
View all →Brooks 017-0146-01 is a prealigner manufactured by Brooks.
The Ultratech 1000 Family is a photolithography step-and-repeat 1X steppers family using the Wynne Dyson optical design.
The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.
