Chroma
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Chroma 58630 is a semiconductor test and probe system.[2]
A wafer prober positions a wafer beneath a set of precision probes that make electrical contact with each die's bond pads.
The prober steps the wafer so that every die can be tested in sequence, and the test system sends and receives signals through the probes to verify the die's electrical performance.
Probing occurs after wafer fabrication and before dicing, when the wafer is still a whole disk of die.
The results of probing are used to map which die are functional and which are defective, so that known-good die can be selected for packaging.
Wafer probers are applied in testing of integrated circuits and other semiconductor devices across a range of product types.
The system may be used during process development, yield improvement, and production testing of wafers.
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
No research found yet — worked with this tool? Share what you know.
The following facts about the 58630 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 58630 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 58630 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 58630 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 58630 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 58630 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Last updated Oct 12, 2026.
The Tenney TPS JR-A-F4T is a junior compact temperature test chamber with a 1.2 cubic foot chamber size and a temperature range of -68°C to +180°C.
The Rorze 03 RR 8120-001-001 is a wafer exchanger for 8-inch wafers.
The KLA 1007 is a wafer prober manufactured by KLA.