RTX-113HV

An X-ray inspection system is a non-destructive inspection tool used to examine internal features that are not directly visible from the exterior. X-ray inspection systems in electronics manufacturing are commonly used to assess solder joints, hidden interconnects, internal voids, and alignment conditions inside assembled parts and layered structures.

The Glenbrook RTX-113HV has optional PC-based image processing with BGA and void measurement software. The Glenbrook RTX-113HV has an optional MicroTech 10-micron X-ray source with 225X magnification. The Glenbrook RTX-113HV has optional motorized X-Y positioning. The Glenbrook RTX-113HV has optional variable-angle viewing that allows 45 degree viewing.^[2]

X-ray inspection systems are typically used after assembly or other fabrication steps that create buried or obscured features. In electronics work, such tools commonly sit after solder attachment, package assembly, drilling, or lamination steps when internal conditions must be checked without sectioning the part. X-ray inspection can also support failure analysis and process troubleshooting by revealing hidden defects before further downstream handling or qualification.

X-ray inspection in electronics is commonly applied where joints, vias, traces, cavities, or embedded features cannot be assessed adequately by visual inspection alone. X-ray inspection in production and laboratory settings is often used for incoming analysis, in-process checks, defect review, and investigative examination of suspect assemblies.