Karl Suss

MA6/BA6

Q: What alignment capability does the Karl Suss MA6/BA6 provide?

The Karl Suss MA6/BA6 provides both frontside and backside mask alignment. The backside align capability includes automated image capture and computer display optics.

Lithography Samples ranging in size from 10mm to 150mm Karl Suss MA6/BA6 family

Research Quality: 40% complete

The Karl Suss MA6/BA6 is a frontside/backside mask aligner. The Karl Suss MA6/BA6 is used for topside or backside photo alignment and exposure. The Karl Suss MA6/BA6 supports samples ranging in size from 10mm to 150mm.^[1]^[2]

Karl SussMA6/BA6

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Plate 01Suss MA6/BA6 Mask Aligner (ID# 4923)
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Plate 02Video 1 of 2 - Karl Suss MA6/BA6 Mask Aligner (ID# 3733)
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Plate 03Video 2 of 2 - Karl Suss MA6/BA6 Mask Aligner (ID# 3733)
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Wafer size

Samples ranging in size from 10mm to 150mm

Performance

0.25 microns under optimum conditions^[1]

Optics

Frontside/Backside Mask Aligner^[1]

What it is

The Karl Suss MA6/BA6 is a frontside and backside mask aligner for photo alignment and exposure. The Karl Suss MA6/BA6 is used for topside or backside photo alignment and exposure. The MA6 portion is designed for high-resolution photolithography in a laboratory environment. The BA6 portion adds backside align capability with automated image capture and computer display optics.^[3]^[1]

How it works

General reference — not yet source-verified

Mask aligners bring a patterned mask into controlled contact or near contact with a resist-coated substrate, then expose the resist with ultraviolet light. Alignment optics let the operator register mask features to existing marks on the substrate before exposure. Backside alignment configurations are used when the relevant marks are viewed through the substrate rather than from the resist side.

What can it run?

Process applications and technology nodes documented for this tool.

Topside or backside photo alignment and exposure
High-resolution photolithography in a laboratory environment

What do the numbers mean?

Vacuum & pumping2

Exposure modes: Hard contact, soft contact, proximity, and vacuum contact^[1]
Exposure methods: Flood, proximity, soft contact, hard contact, low vacuum, vacuum contact^[4]

Wafer handling4

Wafer size: Samples ranging in size from 10mm to 150mm^[2]
Top-side alignment wafer size: Up to 6 in in diameter^[4]
Bottom-side alignment wafer size: 3 in and 4 in chucks^[4]
Maximum wafer thickness: 3 mm^[4]

Optics & imaging14

Category: Frontside/Backside Mask Aligner^[1]
Application: For topside or backside photo alignment and exposure^[3]
Backside alignment: Equipped with backside align capability with automated image capture and computer display optics^[1]
Exposure wavelengths: 350-450nm^[1]
Resolution: Line/space resolution of <1.0 microns under optimum conditions^[1]
Constant intensity control: Constant intensity controller (CIS) regulates lamp power to deliver constant intensity exposures^[1]2 sources
Mask size range: 4" to 7" sq.^[1]
Minimum mask thickness: .09"^[1]
Type: Frontside/Backside Mask Aligner^[1]
Application: Topside or backside photo alignment and exposure^[1]
Exposure wavelengths: UV broadband 250nm-450nm; I-line 365nm; G-line 436nm^[4]
Mask size: 2.5 in x 2.5 in, 4 in x 4 in, 5 in x 5 in, and 8 in x 8 in^[4]
Line/space resolution: <1.0 microns under optimum conditions^[2]
Mask thickness minimum: .09 in^[2]

Performance1

Alignment accuracy: 0.25 microns under optimum conditions^[1]2 sources

Configuration & options5

OEM: Karl Suss^[3]
Model: MA6/BA6^[3]
Lamp house: 350W lamp house containing a 350W mercury short-arc lamp^[1]
Sample size range: 10mm to 150mm^[1]
Category: Lithography^[2]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Exposure modesHard contact, soft contact, proximity, and vacuum contact^[1]
Exposure methodsFlood, proximity, soft contact, hard contact, low vacuum, vacuum contact^[4]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What alignment capability does the Karl Suss MA6/BA6 provide?

The Karl Suss MA6/BA6 provides both frontside and backside mask alignment. The backside align capability includes automated image capture and computer display optics.^[3]^[1]

Not publicly documented

The following facts about the MA6/BA6 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MA6/BA6 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the MA6/BA6 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the MA6/BA6 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the MA6/BA6 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the MA6/BA6 is not on record.
Answerable by: an OEM datasheet or a fab qualification report