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Medalist i 3070 ICT
What it is
General reference — not yet source-verifiedAn in-circuit tester checks assembled electronic hardware by making electrical contact to a board and exercising individual nets or components. An ICT platform belongs in electrical test rather than wafer fabrication.
How it works
General reference — not yet source-verifiedAn ICT system operates by applying electrical probes to a circuit assembly and comparing measured responses against expected behavior. A probe-based tester can support fault isolation on populated boards and related interconnect checks.
Where it fits in the process flow
General reference — not yet source-verifiedThe Medalist i 3070 ICT fits in electronic assembly test flow after board assembly and before final system release. The machine supports electrical verification at the board level rather than patterning or wafer processing.
What do the numbers mean?
Power & electrical3
- 50/60 Hz[1]
Control & software2
- cards 6 control xtpb 64[1]
- Module 3
- probe; debug port; cards 1 asru n revision; cards 2 hybrid advanced double density; cards 3 hybrid advanced double density; cards 4 hybrid advanced double density; cards 5 hybrid advanced double density; cards 6 control xtpb 64; cards 7 hybrid advanced double density; cards 8 hybrid advanced double density; cards 9 hybrid advanced double density; cards 10 hybrid advanced double density; cards 11 access[3]
Configuration & options22
- Series 6[3]
- Four Module system (2 module ready system)[1]
- Module 2 empty[1]
- Module 0 & 1 are absent[1]
- Module 3:[1]
- probe[1]
- debug port[1]
- cards 1 asru n revision[1]
- cards 2 hybrid advanced double density[1]
- cards 3 hybrid advanced double density[1]
- cards 4 hybrid advanced double density[1]
- cards 5 hybrid advanced double density[1]
- cards 7 hybrid advanced double density[1]
- cards 8 hybrid advanced double density[1]
- cards 9 hybrid advanced double density[1]
- cards 10 hybrid advanced double density[1]
- cards 11 access[1]
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Teradyne TS 121 ICT— Same function class: Test & Probe, nullCompare in depthsource[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the Medalist i 3070 ICT are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Medalist i 3070 ICT are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Medalist i 3070 ICT are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Medalist i 3070 ICT are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Medalist i 3070 ICT are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Medalist i 3070 ICT is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]waferpedia.comwaferpedia.com
Last updated Oct 9, 2026.
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