Candela CS 20 V Surface Analyzer

The KLA Candela CS 20 V is a violet laser (405 nm, 25 mW) surface analyzer that handles wafer sizes from 2 to 8 inches.^[1][2]

The KLA Candela CS 20 V operates as a fully automated system with cassette-to-cassette wafer handling, a robotic wafer handler, and dual cassette configuration for pass/fail binning.^[2]

The Candela CS 20 V employs detection modes including scattered light, specular reflection, phase shift, and surface topography mapping.^[1]

The optical system uses a 405 nm, 25 mW diode laser with a spot size of 5 × 6 µm, and the topography measurement achieves a vertical resolution of 1 Å.^[1]

The KLA Candela CS 20 V maintains an internal class 10 cleanroom environment and includes a standard CAS document and installation/site preparation documentation.^[2]

Surface analyzers of this type also serve for incoming wafer quality control, process monitoring, and final verification of polished or deposited thin films.

The Candela CS 20 V is applied to defect detection, film thickness uniformity analysis, particle detection, and surface topography measurement including micro-roughness and waviness.^[1]

The system detects scratches (minimum length 100 µm, width 0.1 µm, depth 50 Å), pits/bumps (minimum diameter 20 µm, depth 50 Å), and stains (minimum diameter 20 µm, film thickness 10 Å).^[1]

Particle detection capability reaches down to 0.08 µm (PSL equivalent) with ≥95% detection rate on polished wafers.^[1]

The KLA Candela CS 20 V is suitable for semiconductor and related optoelectronic materials, including Si, GaAs, Ge, and substrates such as GaAs-on-GaAs and GaAs-on-Ge.^[2]