KLA
OP 7341 XP Film Thickness Measurement
The KLA OP 7341 XP Film Thickness Measurement is a lithography-category film thickness measurement system. The KLA OP 7341 XP Film Thickness Measurement is specified for 12-inch wafers. The KLA OP 7341 XP Film Thickness Measurement has 25 wafer load ports with robot transfer.[1][2][3]
Wafer size
25 wafer load ports (Asyst) with robot transfer (2 paddies)
Power
Power Supply (check RP)[2]
Vacuum
Vacuum[2]
Optics
Separated optical table design[2]
What it is
How it works
The OP 7341 XP supports CD measurement for 1D and 2D features and film stack measurement. The OP 7341 XP includes a prealigner and full alignment using vision processing. The OP 7341 XP has auto-focus. The OP 7341 XP uses an external SuperGrendel server for fast computation with 168 cores. The OP 7341 XP has a measurement chamber with a separated optical table design. The OP 7341 XP uses a pneumatic floating system for vibration isolation of both the stage and the optics tables.[2]
Where it fits in the process flow
Applications
The OP 7341 XP is configured for CD measurement of 1D and 2D features and for film stack measurement.[2]
What do the numbers mean?
Power & electrical1
- Power Supply (check RP)[2]
Vacuum & pumping2
Wafer handling3
Optics & imaging5
Performance3
- Prealigner & full alignment using Vision Processing[2]
Control & software3
- Two user interface (Front & Read)[2]
Configuration & options16
- CD (1D & 2D features) & film stack measurement[2]
- External Server SuperGrendel for fast computation (168 cores)[2]
- Integrated Mini-Environment[2]
- SECS / GEM full capability[2]
- Auto-focus[2]
- Compressed Air[2]
- N2[2]
- Pedestal[2]
- HDD not included[2]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
How does the OP 7341 XP handle wafer alignment?
The OP 7341 XP includes a prealigner and full alignment using vision processing.[2]
Not publicly documented
The following facts about the OP 7341 XP Film Thickness Measurement are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the OP 7341 XP Film Thickness Measurement are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the OP 7341 XP Film Thickness Measurement are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the OP 7341 XP Film Thickness Measurement are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the OP 7341 XP Film Thickness Measurement are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the OP 7341 XP Film Thickness Measurement is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]inventory listing
- [3]OP 7341 XP Film Thickness Measurement — KLA | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 21, 2026.
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