KLA
Wafer size
25 wafer load ports (Asyst) with robot transfer (2 paddies)
Power
Power Supply (check RP)[1]
Vacuum
Vacuum[1]
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
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The following facts about the OP 7341 XP Film Thickness Measurement are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the OP 7341 XP Film Thickness Measurement are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the OP 7341 XP Film Thickness Measurement are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the OP 7341 XP Film Thickness Measurement are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the OP 7341 XP Film Thickness Measurement are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the OP 7341 XP Film Thickness Measurement is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Jul 29, 2026.
The CEE 100 is a lithography spin coater/developer tool that accepts up to 6-inch wafers and supports programmable multi-step processing.
The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.