Surfscan SP 1 Particle Defect

Particle inspection systems are metrology and inspection tools used in semiconductor manufacturing to find contamination and other light-scattering defects on wafer surfaces. Particle inspection systems generally scan the wafer with an optical beam and detect scattered light from particles or defect sites. Particle inspection systems are used to monitor wafer cleanliness, process health, and excursion risk across manufacturing steps.

Particle defect systems generally move a wafer through a controlled optical scan while illumination and collection optics observe the wafer surface for scattering events. Particle defect systems generally convert those scattering signals into defect detections and position data for review, mapping, and trend monitoring. Particle defect systems generally emphasize repeatable surface inspection so fabs can compare defect behavior across lots, tools, and process stages.

Particle inspection tools sit at monitoring points throughout wafer fabrication where surface cleanliness and defectivity need to be checked before subsequent value-adding steps. Particle inspection tools are commonly used after clean, deposition, etch, polish, and other surface-altering operations to verify that a process step has not introduced unacceptable particulate contamination. Particle inspection data can trigger maintenance, process adjustment, or additional review before wafers continue downstream.

Particle defect systems are applied to bare wafers and processed wafers when engineers need to detect surface particles and similar optical defect signatures. Particle defect systems support contamination monitoring, baseline characterization, process qualification, and routine excursion control. Particle defect systems are used where particle adders can affect yield, reliability, or downstream patterning and film performance.