Waferpedia

KLA

Surfscan SP 1 TBI

Surfscan SP 1 TBI — Inventory photo
Fig. 01Surfscan SP 1 TBIInventory photo[1]
  • Plate 01Video 2 of 2 - KLA-Tencor Surfscan SP1 TBI Surface Inspection System (ID# 3728)

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Wafer size

・When loading with FixLoad, the handler reaches maximum speed, causing wafer misalignment due to recoil

Power

208-240 V, Single phase[2]

Vacuum

Open Vacuum Chuck Handler (200/300 mm)[2]

Optics

・Laser (in use for 2 years)[2]

What it is

General reference — not yet source-verified

This class of equipment is used to inspect wafer surfaces for particles, scratches, and other surface defects before or during process monitoring. In fab use, it belongs to optical defect inspection rather than electrical test, and it supports defect detection and classification on unpatterned surfaces.

How it works

General reference — not yet source-verified

In this equipment class, the wafer is scanned optically and surface-scatter or image-based signals are analyzed to find defects against the background of the wafer surface. Such systems are commonly arranged to separate particle-like defects, scratches, and other surface anomalies, and they may include brightfield and darkfield methods to improve defect sensitivity.

Where it fits in the process flow

The Surfscan SP 1 TBI sits in wafer inspection and process monitoring rather than in wafer processing itself. It is used on unpatterned wafers and is suited to inline checks that support yield monitoring and excursion detection.[4]

Applications

General reference — not yet source-verified

The class is used for surface defect inspection in semiconductor manufacturing and, more broadly, for sample-surface anomaly detection where optical methods can reveal contamination or physical defects. In process engineering, the output supports defect review, classification, and yield analysis.

Why won't it start?

Documented failure modes, common issues, and field considerations.

  • When loading with FixLoad, the handler reaches maximum speed, causing wafer misalignment due to recoil
  • Laser in use for 2 years
  • CD drive and FD drive damaged

What do the numbers mean?

Power & electrical3

Phase
208-240 V, Single phase[2]
Accurate?
50/60 Hz[2]
Accurate?
Full Load Amps
24 A[2]
Accurate?

Vacuum & pumping1

Open Vacuum Chuck Handler (200/300 mm)[2]
Accurate?

Wafer handling1

Wafer size
・When loading with FixLoad, the handler reaches maximum speed, causing wafer misalignment due to recoil[2]
Accurate?

Optics & imaging1

・Laser (in use for 2 years)[2]
Accurate?

Control & software2

PC-NFS Cient, P/N
556025[2]
Accurate?
Desktop PC Software Option, P/N
528170[2]
Accurate?

Configuration & options11

Machine Main Breaker Rating
30 A[2]
Accurate?
Ampere Rating of Largest Load
12 A[2]
Accurate?
Bright Field (DIC) Option, P/N
515990[2]
Accurate?
XY Coordination, P/N
0082158-000[2]
Accurate?
Bright Field Sizing, P/N
0082158-000[2]
Accurate?
Haze Normalization, Haze Analysis, P/N
0081928-000[2]
Accurate?
SEC-1, P/N
0021643-000[2]
Accurate?
HSMS, P/N
528080[2]
Accurate?
Color Printer Equivalent to HP Business Inkjet 2300, P/N: T 02379[2]
Accurate?
・CD drive and FD drive damaged[2]
Accurate?
・No issues with performance[2]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Phase208-240 V, Single phase[2]
  • Configuration50/60 Hz[2]
  • Full Load Amps24 A[2]
  • ConfigurationOpen Vacuum Chuck Handler (200/300 mm)[2]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Frequently asked questions

What handling hardware is mentioned?

One configuration includes an open vacuum chuck handler for 200 mm and 300 mm wafers.[2]

Not publicly documented

The following facts about the Surfscan SP 1 TBI are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Surfscan SP 1 TBI are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the Surfscan SP 1 TBI are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the Surfscan SP 1 TBI are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • The process node or technology generation of the Surfscan SP 1 TBI is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the Surfscan SP 1 TBI are on record.

    Answerable by: an OEM parts catalog or a service engineer

Sources & citations

Sources (6)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]Inventory photo
  3. [3]Inventory photo
  4. [4]US6590645B1 - System and methods for classifying anomalies of sample surfaces - Google Patentspatents.google.compatents.google.com
  5. [5]KLA Tencor | Viper 2401 Full Wafer Automated Macro Defect Inspection System - Certified Used Equipmentkla-tencor.com (Jan 8, 2011)web.archive.org
  6. [6]KLA-Tencor Web Site Products - Wafer Inspectiontencor.com (Oct 10, 1999)web.archive.org
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Last updated Jul 29, 2026.

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