Alliance 9400 DSiE

Etchers are semiconductor process tools that remove material from a wafer in patterned areas defined by a masking layer. Etch tools are used after lithographic patterning to transfer features into underlying films, which makes them part of the pattern transfer stage of device fabrication.

Plasma etchers generally expose the wafer to reactive species generated in a process chamber, where the chemistry converts selected film material into volatile byproducts that can be pumped away. Plasma etchers generally balance chemical reaction and ion-assisted bombardment so that material is removed from exposed regions while masked regions remain protected.

Multi-chamber etch systems generally separate process environments so different wafer handling or process steps can be carried out within the same tool platform. Etch tools of this class generally combine vacuum handling with chamber-specific process conditions to support repeatable wafer processing.

Etch tools operate after a masking layer has been formed and patterned on the wafer. Etch tools operate before later steps such as mask removal, cleaning, dielectric or conductor deposition, or additional patterning, depending on the integration sequence.

Semiconductor etchers are used to transfer lithographically defined patterns into thin films and structural layers on wafers. Semiconductor etchers are applied in front end and back end fabrication wherever selective material removal is needed to shape device features, contacts, isolation regions, or interconnect structures.