Waferpedia

MKS

660

Deposition6-inch diameter stageMKS 660 family
Research Quality: 30% complete
MKS660
No photo available yet

Wafer size

6-inch diameter stage

Power

2 RF power supplies[1]

Vacuum

cryo and turbo pumped to 1 x 10^7 Torr[1]

Optics

from a few nm to hundreds of nm[1]

What is it?

Source material identifies the MKS 660 as a sputter deposition system used for metals, alloys, and insulating thin films. It is described as user configurable, with film thickness controllable from a few nm to hundreds of nm, and includes a 6-inch diameter stage, co-sputter capability, reactive sputtering, substrate rotation, and substrate heating up to 200 C.

What can it run?

Process applications and technology nodes documented for this tool.

  • sputter deposition of metals, alloys, and insulating thin films
  • liftoff deposition
  • co-sputtering
  • reactive sputtering

What do the numbers mean?

Power & electrical2

power supplies
2 RF power supplies[1]
Accurate?
DC power supply
switchable DC power supply[1]
Accurate?

Vacuum & pumping2

vacuum system
cryo and turbo pumped to 1 x 10^7 Torr[1]
Accurate?
argon pressure range
3-15 mT controllable with 200 sccm MFC controller[1]
Accurate?

Wafer handling2

substrate rotation
+/- 10% uniformity[1]
Accurate?
substrate heating
up to 200 C[1]
Accurate?

Optics & imaging1

film thickness range
from a few nm to hundreds of nm[1]
Accurate?

Configuration & options6

process
sputter deposition of metals, alloys, and insulating thin films[1]
Accurate?
cathodes
three 3-inch diameter confocal cathodes[1]
Accurate?
co-sputter capability
yes[1]
Accurate?
reactive sputtering
available (Nitrogen or Oxygen)[1]
Accurate?
stage
6-inch diameter stage[1]
Accurate?
liftoff deposition
with sputter power[1]
Accurate?
Interested in this tool?
Embed spec card

What replaced it?

Alternatives

Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • power supplies2 RF power supplies[1]
  • DC power supplyswitchable DC power supply[1]
  • vacuum systemcryo and turbo pumped to 1 x 10^7 Torr[1]
  • argon pressure range3-15 mT controllable with 200 sccm MFC controller[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Not publicly documented

The following facts about the 660 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 660 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 660 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 660 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 660 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 660 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]nanofab.utah.edunanofab.utah.edunanofab.utah.edu
  2. [2]nanofab.utah.edunanofab.utah.edu
Was this page accurate?

Last updated Jul 29, 2026.

Compare with similar tools

View all →